Title:
PACKING MATERIAL CONTAINING TUNGSTEN AND INTEGRATED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2011/028042
Kind Code:
A2
Abstract:
The present invention relates to a packing material of an integrated package for protecting a semiconductor integrated circuit corresponding to a key component of electronic equipment from nuclear electromagnetic wave radiation. The present invention can implement packing material which protects a semiconductor wafer from the electromagnetic wave radiation (figure 1) by using a tungsten compound as a main component of an epoxy molding compound (EMC), and can improve total performance of the integrated package material such as the closest thermal expansion coefficient to the semiconductor wafer (figure 2), the relatively high thermal conductivity in comparison with the silicon (figure 3) and the like.
Inventors:
PARK YOUNG-WOONG (KR)
Application Number:
PCT/KR2010/005973
Publication Date:
March 10, 2011
Filing Date:
September 03, 2010
Export Citation:
Assignee:
PARK YOUNG-WOONG (KR)
International Classes:
H01L23/28
Foreign References:
| JPH10286845A | 1998-10-27 | |||
| KR100575086B1 | 2006-04-24 | |||
| KR20080023996A | 2008-03-17 |
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