PACKING STRUCTURE FOR PACKING SUBSTRATE STORING CONTAINER

WIPO Patent Application WO/2015/015615

A1

A packing structure (1) for packing a substrate storing container (2) for storing and transporting substrates (W), each of which is configured of a semiconductor wafer, is provided with a packing box (10), an upper cushioning material (30), a lower cushioning material (40), and an elastic supporting member (60). The upper cushioning material (30) is placed above the substrate storing container (2) in the packing box (10). The substrate storing container (2) is placed on the lower cushioning material (40). The lower cushioning material (40) is disposed in the packing box (10) such that the substrate storing container (2) is sandwiched in the vertical direction by means of the upper cushioning material (30) and the lower cushioning material (40). Furthermore, the lower cushioning material (40) is not in contact with any one of a first side plate (121), a second side plate (122), a front plate and a rear plate of the packing box (10), and a lower space (104) is formed between the lower cushioning material (40) and the first side plate (121), the second side plate (122), the front plate and the rear plate of the packing box (10).

NAGASHIMA TSUYOSHI (JP)

PCT/JP2013/070865

February 05, 2015

August 01, 2013

Click for automatic bibliography generation  

MIRAIAL CO LTD (JP)

B65D81/07; B65D81/113; B65D85/86; H01L21/673

JP2010132331A	2010-06-17
JP2003026232A	2003-01-29
JP2004168324A	2004-06-17
JPS51139172U	1976-11-10
JPS53135279U	1978-10-26
JPS58159268U	1983-10-24
JPS63197830U	1988-12-20
JP3019701U	1996-01-12

SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)

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