PAD STRUCTURE FOR TRANSFER APPARATUS, AND PAD MANUFACTURING METHOD FOR TRANSFER APPARATUS

WIPO Patent Application WO/2010/106658

A1

Provided are a pad structure for a transfer apparatus, which can manage the temperature of a pad precisely and can make it unnecessary to have a heating means separately so that the transfer apparatus can be simplified in construction, reduced in mounting space and improved in economy, and a method of manufacturing the pad. A pad (14) for use in the transfer apparatus comprises a base portion (18) connected with a mounting base (24) to be fixed on a forward/backward means (26) and having an insulating property and a higher hardness than that of a leading end portion (12), a heating unit (20) fixed on the leading end side of the base portion (18), for generating heat when energized, the leading end portion (12) covering the leading end side of the base portion (18) and the heating unit (20) with a heat-resisting soft elastic material, and terminal portions (22) having metal lead wires (22a) extended to the outside of the pad (14), for energizing the heating unit (20). When the pad (14) is pushed onto a transfer sheet (10), the heating unit (20) is energized through the terminal portions (22) by a heat source means, thereby to heat the pad (14).

MURATA OSAMU (JP)
ABE YOSHIKAZU (JP)

PCT/JP2009/055357

September 23, 2010

March 18, 2009

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ARROW PLANNING CO LTD (JP)
TOKUSYU ABE SEIHANJO CO LTD (JP)
MURATA OSAMU (JP)
ABE YOSHIKAZU (JP)

B41F17/34; B41F16/00; B41M1/40; B44C1/17

JPS5811189A	1983-01-21
JPS5943137U	1984-03-21
JPS59160233U	1984-10-26
JPH06134969A	1994-05-17
JPS6222832U	1987-02-12
JP2004188717A	2004-07-08
JP2009061662A	2009-03-26

FUJIMOTO, Eisuke et al. (JP)
Eisuke Fujimoto (JP)

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