PANEL HAVING A CLEANING FUNCTION, AND METHOD FOR CLEANING A SUBSTRATE TREATMENT APPARATUS USING THE PANEL

WIPO Patent Application WO/2010/023807

A1

Disclosed is a method for cleaning a substrate treatment apparatus by passing a panel having cleaning function through the substrate treatment apparatus, so that the collection of a foreign matter and the excellent conveyance of the panel are made compatible.  The cleaning method is characterized in that a panel having cleaning function, which comprises a support, a cleaning member and a non-adhesive or poor-adhesive member, is passed through the substrate treatment apparatus.  The cleaning member is partially adhered to at lest one surface of the support, and has an adhesion of 0.10N /20 mm or higher (which is measured according to Testing Method of JIS Z0237 and under conditions of a peeling speed: 300 mm/minute and a peeling angle: 90 degrees with respect to a silicon mirror wafer).  The non-adhesive or poor-adhesive member is adhered to the remaining portion of the surface, to which the cleaning member has been adhered.

MURATA, Akihisa (1-1-2 Shimohozumi, Ibaraki-sh, Osaka 80, 〒5678680, JP)
村田　秋桐 (〒80 大阪府茨木市下穂積１丁目１番２号　日東電工株式会社内 Osaka, 〒5678680, JP)

JP2009/003224

March 04, 2010

July 10, 2009

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NITTO DENKO CORPORATION (1-1-2, Shimohozumi Ibaraki-sh, Osaka 80, 〒5678680, JP)
日東電工株式会社 (〒80 大阪府茨木市下穂積１丁目１番２号 Osaka, 〒5678680, JP)
MURATA, Akihisa (1-1-2 Shimohozumi, Ibaraki-sh, Osaka 80, 〒5678680, JP)

B08B1/00; H01L21/027; H01L21/304

SHINJYU GLOBAL IP (South Forest Bldg, 1-4-19 Minamimori-machi, Kita-ku, Osaka-sh, Osaka 54, 〒5300054, JP)

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