Title:
PANEL HEATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/008481
Kind Code:
A1
Abstract:
A panel heating device (1) comprising a pipe (3) through which a heating medium flows, a panel (2) having a groove (20) for pipe arrangement wherein said pipe is arranged formed in the upper surface thereof, and a surface heat equalizing plate (4) made from metal and arranged on the upper surface of said panel; and characterized by a plurality of high heat conducting sheets (5) comprising a material of higher heat conductivity than the surface heat equalizing plate being arranged between the panel and the surface heat equalizing plate, and the high heat conducting sheets having at least one end thereof being connected to the pipe and being arranged in a direction orthogonal to the pipe arrangement direction.
Inventors:
UEDA SHIGEYUKI
Application Number:
PCT/JP2012/051918
Publication Date:
January 17, 2013
Filing Date:
January 30, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
UEDA SHIGEYUKI
UEDA SHIGEYUKI
International Classes:
F24D3/16
Foreign References:
| JP2008184864A | 2008-08-14 | |||
| JPS60111415U | 1985-07-29 |
Attorney, Agent or Firm:
NAKAI, Hiroyuki et al. (JP)
Hiroyuki Nakai (JP)
Hiroyuki Nakai (JP)
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Claims: