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Patent Searching and Data


Title:
PANEL MANUFACTURING DEVICE, PANEL MANUFACTURING METHOD, AND PANEL
Document Type and Number:
WIPO Patent Application WO/2022/219906
Kind Code:
A1
Abstract:
This panel manufacturing device is provided with: a conveyance part for conveying, in the conveyance direction, a panel that has a core member containing a thermoplastic resin and formed in a corrugated shape, and a first faceplate containing the thermoplastic resin, formed in a plate shape, and joined to a surface on one side of the core member; a supply part for supplying, toward a surface on the other side of the core member, a second faceplate that contains the thermoplastic resin and is formed in a plate shape; and a joining part for joining the core member and the second faceplate together to form a joined part. The first faceplate has a plurality of through holes formed by penetrating therethrough in order to allow access to the core member. The joining part forms the joined part via the through holes of the first faceplate.

Inventors:
KOYAMA TAKAYUKI (JP)
TAKAGI KIYOKA (JP)
SENNYU KATSUYA (JP)
TAKAKUWA YOSHINAO (JP)
MIYAKE TAKAYUKI (JP)
AIKAWA KATSUHIDE (JP)
Application Number:
PCT/JP2022/005668
Publication Date:
October 20, 2022
Filing Date:
February 14, 2022
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
MITSUBISHI HEAVY IND MACH SYSTEMS LTD (JP)
International Classes:
E04C2/20; B29C65/08; B29C65/16
Foreign References:
JPH08156087A1996-06-18
JP2018535846A2018-12-06
JP2019188802A2019-10-31
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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