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Title:
PANEL MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/113999
Kind Code:
A1
Abstract:
Provided is a panel manufacturing method provided with an extrusion step, a shaping step, an insert step, and a mold-closing step. In the extrusion step, a first resin sheet and a second resin sheet are extruded between a first die and a second die, the second resin sheet being positioned between the first resin sheet and the second die. In the shaping step, the first resin sheet and the second resin sheet are respectively shaped along the respective cavity surfaces of the first die and the second die. In the insert step, a foam body is positioned between the first resin sheet and the second resin sheet. In the mold-closing step, the first die and the second die are closed. The second die is provided with a convex ridge forming a hinge part, the tip of the convex ridge being provided with a first protrusion and a second protrusion corresponding to the first hinge and the second hinge, and a groove that corresponds to an intermediate part and that is positioned between the first protrusion and the second protrusion. In the mold-closing step, the first resin sheet, the second resin sheet, and the foam body are sandwiched and compressed between the first mold and the tip of the convex ridge, whereby the hinge part is formed. Where the depth of the groove is represented by Dg and the thickness of the second resin sheet is represented by Ts2, the value of Dg/Ts2 is 1.5 to 3.

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Inventors:
HARASAWA YUKI (JP)
NAKAJIMA SHO (JP)
ISHIDA RYUICHI (JP)
Application Number:
PCT/JP2021/042984
Publication Date:
June 02, 2022
Filing Date:
November 24, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYORAKU CO LTD (JP)
International Classes:
B29C51/26; B29C51/12; A47K3/00; B60R5/04; E05D1/02
Domestic Patent References:
WO2019151213A12019-08-08
Foreign References:
JP2020179528A2020-11-05
JP2002046168A2002-02-12
JPH01209130A1989-08-22
JP2013103422A2013-05-30
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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