Title:
PANEL PROCESSING METHOD, PANEL, AND PANEL PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/100721
Kind Code:
A1
Abstract:
A base plate (111) is first placed in a bottom part of an embedding hole (103) provided in a honeycomb core (101). A filler (113) for blocking gaps between side parts of the base plate and wall surfaces of the honeycomb core is then applied to a top surface of the base plate. A push plate (112) is then pushed against the filler. As a result, the filler protrudes into the gaps, and the gaps are blocked by the filler.
Inventors:
HARADA KATSUYA (JP)
TSUZUKI EIJI (JP)
SHIODA KAZUMA (JP)
NAGAKURA YASUNORI (JP)
MATSUNAGA KEISHI (JP)
SAKAKIBARA TAKAHIRO (JP)
TSUZUKI EIJI (JP)
SHIODA KAZUMA (JP)
NAGAKURA YASUNORI (JP)
MATSUNAGA KEISHI (JP)
SAKAKIBARA TAKAHIRO (JP)
Application Number:
PCT/JP2016/085784
Publication Date:
June 07, 2018
Filing Date:
December 01, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B32B3/12; B05D3/12; C09J5/00; F16B5/01
Domestic Patent References:
| WO2014121105A1 | 2014-08-07 |
Foreign References:
| JP2000215929A | 2000-08-04 | |||
| JP2001140362A | 2001-05-22 | |||
| JPH11348157A | 1999-12-21 | |||
| JPH11348155A | 1999-12-21 | |||
| JP2001140362A | 2001-05-22 |
Other References:
See also references of EP 3549756A4
Attorney, Agent or Firm:
MIZOI, Shoji et al. (JP)
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