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Title:
PANEL STRUCTURE MANUFACTURING DEVICE AND PANEL STRUCTURE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/219910
Kind Code:
A1
Abstract:
A panel structure manufacturing device comprising: a shaping device that shapes the surface of a thermoplastic resin into a relief shape and forms a plate-like core member; a heating device that selectively heats the surface of the core member; and a pressurizing device that pressurizes a heated spot of the core member that the heating device has heated and a plate-like face plate, and fuses together the core member and the face plate.

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Inventors:
KOYAMA TAKAYUKI (JP)
TAKAGI KIYOKA (JP)
SENNYU KATSUYA (JP)
TAKAKUWA YOSHINAO (JP)
MIYAKE TAKAYUKI (JP)
AIKAWA KATSUHIDE (JP)
Application Number:
PCT/JP2022/005715
Publication Date:
October 20, 2022
Filing Date:
February 14, 2022
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
MITSUBISHI HEAVY IND MACH SYSTEMS LTD (JP)
International Classes:
B29C51/20; B29C65/02; B29C65/08; B29C65/32; B29C69/00; E04C2/20
Domestic Patent References:
WO2013146634A12013-10-03
Foreign References:
JP2018099883A2018-06-28
JPS5118468B11976-06-10
JP2019188802A2019-10-31
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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