Title:
PANEL, STRUCTURE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/127893
Kind Code:
A1
Abstract:
Provided is a panel manufacturing method that achieves excellent bonding strength and lightweight property and enables efficient manufacturing. The present invention provides a panel manufacturing method including a first bonding step and a second bonding step. In the first bonding step, a surface material is bonded to a base material to form a bonded body. In the second bonding step, a skin material is bonded to the bonded body to form a panel. The first bonding step includes a first coating step and a first affixing step. In the first coating step, a first adhesive is coated on the surface material by means of a roll coater. In the first affixing step, a surface of the surface material on which the first adhesive has been coated is affixed onto the base material to form the bonded body. The second bonding step includes a second coating step and a second affixing step. In the second coating step, a second adhesive is coated on the skin material by means of a spray coater. In the second affixing step, a surface of the skin material on which the first adhesive has been coated is affixed onto the bonded body. In the second affixing step, the skin material is affixed so as to cover at least a part of a first main surface and a side surface of the bonded body and at least a part of a second main surface of the bonded body.
Inventors:
KOMENO TAKASHI (JP)
YOSHIDA KOUICHIRO (JP)
HAYASHI YOSUKE (JP)
KUNIMORI KENTARO (JP)
MATSUBARA YOSHITAKA (JP)
TOZAKI KOHEI (JP)
IHARA RYOTARO (JP)
YOSHIDA KOUICHIRO (JP)
HAYASHI YOSUKE (JP)
KUNIMORI KENTARO (JP)
MATSUBARA YOSHITAKA (JP)
TOZAKI KOHEI (JP)
IHARA RYOTARO (JP)
Application Number:
PCT/JP2022/048271
Publication Date:
July 06, 2023
Filing Date:
December 27, 2022
Export Citation:
Assignee:
KYORAKU CO LTD (JP)
International Classes:
B32B15/08; B05D1/02; B05D1/28; B05D1/38; B05D3/12; B05D7/24; B29C51/10; B29C51/12; B29C69/02; B29D7/00; B32B7/00; B32B7/12; B32B37/12; B60R5/04; F16B5/10
Foreign References:
| JP2019188749A | 2019-10-31 | |||
| JP2021062561A | 2021-04-22 | |||
| JP2018047586A | 2018-03-29 | |||
| JP2014079901A | 2014-05-08 | |||
| JP2018114698A | 2018-07-26 | |||
| JP2021147760A | 2021-09-27 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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