Title:
PANELIZATION PROCESSING EDGE AND PANELIZATION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/052091
Kind Code:
A1
Abstract:
The invention discloses a panelization processing edge and a panelization method. A panelization processing edge (100) is disposed at the periphery of a pattern unit (200) of a circuit board, comprising at least two layers of overlapping processing edges (10). Copper balance points (11) are provided on each processing edge, and the residual copper ratio of each layer of the panel processing edges is the same as the residual copper ratio of a corresponding layer of the pattern unit. The panel of the panelization method comprises: a panelization processing edge, and a pattern unit and a test strip or a test module (300) provided within the panelization processing edge. The residual copper ratio of each layer of the panelization processing edge is the same as the residual copper ratio of a corresponding layer of the pattern unit. Therefore, the method ensures that the thickness of a dielectric layer between the panelization processing edge and the pattern unit is consistent after lamination and sealing, thereby improving consistency of the thickness of a panel. The method further ensures a more uniform distribution of current density between the panelization processing edge and the pattern unit during electroplating, so as to increase the accuracy of test results of a test strip or a test module comprised in the panelization processing edge, effectively indicating actual values related to the pattern unit.
Inventors:
CHENG LIUJUN (CN)
LI YANGUO (CN)
CHEN BEI (CN)
LI YANGUO (CN)
CHEN BEI (CN)
Application Number:
PCT/CN2017/120095
Publication Date:
March 21, 2019
Filing Date:
December 29, 2017
Export Citation:
Assignee:
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
YIXING SILICON VALLEY ELECTRONICS TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
YIXING SILICON VALLEY ELECTRONICS TECH CO LTD (CN)
International Classes:
H05K1/02; H05K1/14
Foreign References:
| CN102711370A | 2012-10-03 | |||
| JPH0783179B2 | 1995-09-06 | |||
| JPH05211392A | 1993-08-20 | |||
| CN201491385U | 2010-05-26 | |||
| CN205946335U | 2017-02-08 | |||
| CN106231799A | 2016-12-14 | |||
| JPH0312996A | 1991-01-21 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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