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Patent Searching and Data


Title:
PAPER CUP PROVIDED WITH HEAT CONDUCTION PREVENTION PLATE
Document Type and Number:
WIPO Patent Application WO/2018/155863
Kind Code:
A1
Abstract:
The present invention relates to a paper cup provided with a heat conduction prevention plate. The paper cup is provided integrally with a heat conduction prevention plate by being attached to the paper cup, and thus it is not necessary for a user to frequently insert a separate heat conduction prevention plate into the paper cup when drinking a drink. Also, a certain space is formed between the integrated heat conduction prevention plate and the paper cup body, thereby effectively performing a heat conduction blocking function. Moreover, since the heat conduction prevention plate is provided in an area that can be held by a finger, it is possible to be manufactured at a low manufacturing cost, and the paper cup widens toward the top, so that the paper cup slips less from fingers.

Inventors:
KANG, Kyung Wook (178 Songu-ro, Soheul-eupPocheon-si, Gyeonggi-do, 11171, KR)
Application Number:
KR2018/001941
Publication Date:
August 30, 2018
Filing Date:
February 14, 2018
Export Citation:
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Assignee:
KANG, Kyung Wook (178 Songu-ro, Soheul-eupPocheon-si, Gyeonggi-do, 11171, KR)
International Classes:
B65D81/38; A47G23/02; B65D3/28; B65D25/20; B65D85/72
Foreign References:
KR20030024332A2003-03-26
KR20080004515U2008-10-09
KR101641534B12016-07-21
KR20090057176A2009-06-04
KR20100127331A2010-12-06
Attorney, Agent or Firm:
MAJOR PATENT AND LAW FIRM (the third floor, 10 Teheran-ro 20-gil,Gangnam-gu, Seoul, 06235, KR)
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