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Patent Searching and Data


Title:
PAPER-FREE PREPREGS
Document Type and Number:
WIPO Patent Application WO/2003/102055
Kind Code:
A1
Abstract:
A paper-free prepreg constituted of a reinforcing fiber-matrix layer prepared by impregnating a reinforcing fiber with a non-cured matrix resin and a releasing resin film which has a heavy surface exhibiting a high peel strength and a light surface exhibiting a low peel strength and adheres to one surface of the reinforcing fiber-matrix layer with the heavy surface being in contact with the reinforcing fiber-matrix layer, wherein the heavy surface exhibits a peel strength of 200 g/cm or below and the peel strength ratio of the heavy surface to the light surface is 3.0 or above; and a paper-free prepreg as described above which has a cover film adhering to the other surface thereof. When the cover film is a specific thermoplastic resin film made from polyamide 12, ionomer or the like, the prepreg can be molded without removing the cover film.

Inventors:
KAWAKAMI ATSUSHI (JP)
ENDO YOSHIHIRO (JP)
TOMINAGA HIDEAKI (JP)
HIKAWA ETSUHIRO (JP)
Application Number:
PCT/JP2003/006511
Publication Date:
December 11, 2003
Filing Date:
May 26, 2003
Export Citation:
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Assignee:
TOHO TENAX CO LTD (JP)
KAWAKAMI ATSUSHI (JP)
ENDO YOSHIHIRO (JP)
TOMINAGA HIDEAKI (JP)
HIKAWA ETSUHIRO (JP)
International Classes:
B32B5/22; (IPC1-7): C08J5/24; B32B5/00
Foreign References:
JPS5947277A1984-03-16
JPH07246616A1995-09-26
JPH10298315A1998-11-10
JPS59135121A1984-08-03
JPS5947278A1984-03-16
JP2002105223A2002-04-10
JPH08290514A1996-11-05
JPH09216305A1997-08-19
Attorney, Agent or Firm:
Takahata, Yasuyo (MAISON-SUNSHINE 1-4, Higashi-Ikebukuro 3-chom, Toshima-ku Tokyo, JP)
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