Title:
PAPER PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/135882
Kind Code:
A1
Abstract:
Disclosed is a paper processing apparatus wherein paper is conveyed sheet by sheet by a conveying mechanism along a conveying path (19), and wherein in the conveying path (19), each sheet of paper is cut into a plurality of rectangular products, and the corners of the products are chamfered. The paper processing apparatus is provided with a chamfer cutting mechanism (15) wherein a plurality of pairs of chamfer cutting blades (26) are disposed on the same straight line along a conveying width direction (W), said pairs of chamfer cutting blades (26) being such that the components of each pair are disposed at an interval from each other in the conveying width direction (W) in such a way as to face each other; a rotating blade type cutting mechanism (16) wherein a plurality of rotating blades (61a) which cut paper along a conveying direction (F) are disposed at intervals in the conveying width direction (W); and a reciprocating blade type cutting mechanism (17) which comprises a pair of cutting blades that cut paper along the conveying width direction (W), said pair of cutting blades consisting of an upper cutting blade and a lower cutting blade. Preferably, the reciprocating blade type cutting mechanism (17) is disposed in the most downstream side of conveyance.
Inventors:
OIWA, Hideki (353 Koudai, Kinokawa-sh, Wakayama 51, 〒6496551, JP)
大岩 英紀 (〒51 和歌山県紀の川市上田井３５３デュプロ精工株式会社内 Wakayama, 〒6496551, JP)
TOKI, Akihiko (353 Koudai, Kinokawa-sh, Wakayama 51, 〒6496551, JP)
大岩 英紀 (〒51 和歌山県紀の川市上田井３５３デュプロ精工株式会社内 Wakayama, 〒6496551, JP)
TOKI, Akihiko (353 Koudai, Kinokawa-sh, Wakayama 51, 〒6496551, JP)
Application Number:
JP2011/052209
Publication Date:
November 03, 2011
Filing Date:
February 03, 2011
Export Citation:
Assignee:
Duplo Seiko Corporation (353 Koudai, Kinokawa-shi Wakayama, 51, 〒6496551, JP)
デュプロ精工株式会社 (〒51 和歌山県紀の川市上田井３５３ Wakayama, 〒6496551, JP)
OIWA, Hideki (353 Koudai, Kinokawa-sh, Wakayama 51, 〒6496551, JP)
大岩 英紀 (〒51 和歌山県紀の川市上田井３５３デュプロ精工株式会社内 Wakayama, 〒6496551, JP)
デュプロ精工株式会社 (〒51 和歌山県紀の川市上田井３５３ Wakayama, 〒6496551, JP)
OIWA, Hideki (353 Koudai, Kinokawa-sh, Wakayama 51, 〒6496551, JP)
大岩 英紀 (〒51 和歌山県紀の川市上田井３５３デュプロ精工株式会社内 Wakayama, 〒6496551, JP)
International Classes:
B26D11/00; B26D1/24
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (AOYAMA & PARTNERS, IMP Building 3-7, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, 〒5400001, JP)
Claims:
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