Title:
PAPERBOARD DIE-CUTTING APPARATUS HAVING A GUIDE PLATE FOR PROTECTING CUT SURFACES
Document Type and Number:
WIPO Patent Application WO/2012/039583
Kind Code:
A2
Abstract:
The present invention relates to a paperboard die-cutting apparatus having a guide plate for protecting cut surfaces. The apparatus of the present invention comprises a first die, a first press, a second die and a second press. The first die includes a first support on which paperboard is placed, and a first die-fixing portion and a cutter blade which are movable in the vertical direction toward the first support. The first press includes a first die guide plate which is arranged at the first die-fixing portion such that the first die guide plate is movable in the vertical direction, and which is brought into contact with an upper surface of the paperboard prior to the contact of the cutter blade of the first die when the first die-fixing portion descends. The second die includes a second support on which paperboard is placed, and a second die-fixing portion and a cutter blade which are movable in the vertical direction toward the second support. The second press includes a second die guide plate which is arranged at the second die-fixing portion such that the second die guide plate is movable in a vertical direction, and which is brought into contact with an upper surface of the paperboard prior to the contact of the cutter blade of the second die when the second die-fixing portion descends.
Inventors:
LEE HWAN (KR)
Application Number:
PCT/KR2011/006955
Publication Date:
March 29, 2012
Filing Date:
September 20, 2011
Export Citation:
Assignee:
LEE HWAN (KR)
International Classes:
B26F1/40; B26F1/38; B26F1/44
Foreign References:
| JPH1158299A | 1999-03-02 | |||
| KR20060099344A | 2006-09-19 | |||
| JPH09271858A | 1997-10-21 | |||
| US5253559A | 1993-10-19 |
Attorney, Agent or Firm:
DYNE PATENT & LAW FIRM (KR)
특허법인 다인 (KR)
특허법인 다인 (KR)
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Claims: