Title:
PARALLEL PROCESSING APPARATUS AND PARALLEL PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/203617
Kind Code:
A1
Abstract:
A parallel processing apparatus according to the present invention is provided with: a master machine (1); and a slave machine (2) that has a plurality of characteristic calculation units (23), and parallelly calculates reception characteristics at a reception point when waves radiated from a transmission source reach the reception point in a reception area. The master machine (1) is provided with: a data sorting unit (12) that performs a ray-tracing process for tracing the propagation paths of the waves from the transmission source to the reception point, and sorts data indicating the paths of the waves acquired through the ray-tracing process in the order of the propagation paths; and a data allocation unit (15) that divides the data that indicates the paths of the waves and that is sorted by the data sorting unit, and allocates the divided data to the characteristic calculation units. The slave machine (2) parallelly calculates the reception characteristics at the reception point by the characteristic calculation units (23) by using the data indicating the paths of the waves allocated by the data allocation unit (15). Thus, in a calculation process using a ray-tracing method, regular access to a memory area is enabled, and processing time can be shortened.
Inventors:
MATSUO SAKI (JP)
GOCHO MASATO (JP)
OZAKI ATSUO (JP)
GOCHO MASATO (JP)
OZAKI ATSUO (JP)
Application Number:
PCT/JP2016/065402
Publication Date:
November 30, 2017
Filing Date:
May 25, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G06F17/50; H04B17/391
Foreign References:
| JP2004294133A | 2004-10-21 | |||
| JP2007080095A | 2007-03-29 | |||
| JPH0933584A | 1997-02-07 |
Attorney, Agent or Firm:
INABA, Tadahiko et al. (JP)
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