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Patent Searching and Data


Title:
PARENT-CHILD SET OF TIN TANKS AND DIP SOLDERING EQUIPMENT HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2019/140846
Kind Code:
A1
Abstract:
A parent-child set of tin tanks comprises a parent tin tank (151), a child tin tank (152) and a lifting device. The parent tin tank has a cavity for accommodating molten tin. The child tin tank is provided inside the cavity and is driven by the lifting device to move in a depth direction of the parent tin tank so as to be lifted out from or submerged into the molten tin in the cavity. Also provided is dip soldering equipment comprising a support (110), a driving device, a gripping and dipping mechanism (147) and a parent-child set of tin tanks. The gripping and dipping mechanism is used to grip a product to be dip soldered, and can be driven by the driving device to move the product to a lifted child tin tank to undergo dip soldering. The equipment can solve a problem in which consumption of tin in a single tin tank results in a lower molten tin level, and does not need to be turned off to add molten tin, thereby maximally increasing operation efficiency of the equipment.

Inventors:
ZHAO SHENGYU (CN)
LIU MINGQING (CN)
WANG JIESHUN (CN)
ZHONG HUI (CN)
HUANG SHISHENG (CN)
GAO CAIFENG (CN)
XIONG ZHENSHAN (CN)
ZHOU YUCHAO (CN)
ZHANG SONGLING (CN)
Application Number:
PCT/CN2018/089609
Publication Date:
July 25, 2019
Filing Date:
June 01, 2018
Export Citation:
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Assignee:
SHENZHEN HYMSON LASER INTELLIGENT EQUIPMENTS CO LTD (CN)
International Classes:
B23K3/00; B23K1/008; B23K3/08
Foreign References:
CN206010083U2017-03-15
KR20070010565A2007-01-24
CN101987387A2011-03-23
CN104439604A2015-03-25
CN204991453U2016-01-20
Attorney, Agent or Firm:
JIAQUAN IP LAW FIRM (CN)
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