Title:
PARISON WALL THICKNESS-ADJUSTING DEVICE, PARISON WALL THICKNESS-ADJUSTING METHOD, BLOW-MOLDING APPARATUS, AND BLOW-MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/209154
Kind Code:
A1
Abstract:
[Problem] To provide a parison wall thickness-adjusting device and parison wall thickness-adjusting method with which it is possible to reduce the driving mechanisms and to perform wall thickness adjustment smoothly. [Solution] In a die head for supplying a cylindrical parison from a circular slit between a die and a core, pairs of pressurizing mechanisms for pressing the die are disposed so as to face each other and said pairs of pressurizing mechanisms are controlled so as to work together. The two sets of pressurizing mechanisms are disposed roughly orthogonal to each other. Each pressurizing mechanism has a hydraulic cylinder and the head-side of the hydraulic cylinders of the pairs of pressurizing mechanisms that face each other are in communication with each other through piping. Said pairs of pressurizing mechanisms are driven by the hydraulic unit of single systems.
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Inventors:
IGARASHI YU (JP)
MAENO HIROAKI (JP)
HIROSE SHINYA (JP)
MAENO HIROAKI (JP)
HIROSE SHINYA (JP)
Application Number:
PCT/JP2017/020165
Publication Date:
December 07, 2017
Filing Date:
May 30, 2017
Export Citation:
Assignee:
KYORAKU CO LTD (JP)
International Classes:
B29C49/42; B29C49/04; B29C49/48
Foreign References:
JP2008238727A | 2008-10-09 | |||
JPH07144355A | 1995-06-06 |
Attorney, Agent or Firm:
ASANO Noriko (JP)
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