Title:
PART MOUNTING HEAD, PICK-UP NOZZLE, PICK-UP NOZZLE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2005/061188
Kind Code:
A1
Abstract:
A pick-up holding surface (14) of a pick-up nozzle (3) for picking up a part (1) is made of a semiconductor ceramic. As a result, the pick-up holding surface brought into direct contact with the part when the part is picked up and held is given a characteristic of semiconductor. Consequently, the adverse effect due to static electricity generated in the pick-up nozzle and the adverse effect due to electrical connection between the pick-up nozzle and at the part are avoided.
Inventors:
UCHIDA HIDEKI
ARAI RISA
ENDO SHIN-ICHIRO
KIDO KAZUO
ARAI RISA
ENDO SHIN-ICHIRO
KIDO KAZUO
Application Number:
PCT/JP2004/018705
Publication Date:
July 07, 2005
Filing Date:
December 15, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
UCHIDA HIDEKI
ARAI RISA
ENDO SHIN-ICHIRO
KIDO KAZUO
UCHIDA HIDEKI
ARAI RISA
ENDO SHIN-ICHIRO
KIDO KAZUO
International Classes:
B25J15/06; H05K13/04; (IPC1-7): B25J15/06
Foreign References:
| JPH05275513A | 1993-10-22 | |||
| JP2000021963A | 2000-01-21 | |||
| JPH043500A | 1992-01-08 | |||
| JP2002307359A | 2002-10-23 | |||
| JPH05251544A | 1993-09-28 |
Other References:
See also references of EP 1707325A4
Attorney, Agent or Firm:
Kawamiya, Osamu (IMP Building 3-7, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, JP)
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