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Title:
PART SUPPLY DEVICE AND PART SUPPLY METHOD
Document Type and Number:
WIPO Patent Application WO/2014/016980
Kind Code:
A1
Abstract:
A part supply device (10) has a sloped path (P2) for carrier tape (200) that extends linearly in a diagonally upwards direction, a horizontal path (P3) for carrier tape (200) that extends linearly in a horizontal manner from the front end of the sloped path (P2) and passes through a part supply position (Q), a first sprocket (12) that engages with feed holes (202b) in the carrier tape (200) on the sloped path (P2), a guide member (14) that provides widthwise registration for the carrier tape (200) on the horizontal path (P3), a top tape peeling mechanism (50) that is located above the sloped path (P2) between the first sprocket (12) and the horizontal path (P3) and partially peels a top tape (204) from a base tape (202) to expose a part, and a sprocket driving mechanism (16) that rotates the first sprocket (12).

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Inventors:
KITANI MINORU
HIGUCHI MOTOHIRO
MATSUKAWA SHIGERU
KIDO KAZUO
Application Number:
PCT/JP2013/000853
Publication Date:
January 30, 2014
Filing Date:
February 15, 2013
Export Citation:
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Assignee:
PANASONIC CORP (JP)
International Classes:
H05K13/02
Foreign References:
JP2005539370A2005-12-22
JPS63112366A1988-05-17
JP2007027246A2007-02-01
JP2007067156A2007-03-15
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
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