Title:
PARTING METHOD FOR FRAGILE MATERIAL SUBSTRATE AND PARTING DEVICE USING THE METHOD
Document Type and Number:
WIPO Patent Application WO2003082542
Kind Code:
B1
Abstract:
A parting method for a fragile material substrate and a parting device using the method, the parting method comprising a scribe step for scribing the fragile material substrate in such a state that a protective member is applied onto one surface of the substrate; the parting device comprising a first scribing device for performing the scribe step, whereby cullet produced when the substrate is parted can be effectively removed, and the substrate can be accurately parted along a scribe line by forming a vertical crack extending deep into the substrate.
Inventors:
MAEKAWA KAZUYA (JP)
SOYAMA HIROSHI (JP)
SOYAMA HIROSHI (JP)
Application Number:
PCT/JP2003/004159
Publication Date:
February 19, 2004
Filing Date:
April 01, 2003
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
MAEKAWA KAZUYA (JP)
SOYAMA HIROSHI (JP)
MAEKAWA KAZUYA (JP)
SOYAMA HIROSHI (JP)
International Classes:
B28D5/00; C03B33/033; C03B33/07; C03B33/10; (IPC1-7): B28D5/00; C03B33/023
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