BACKGROUND

[0001] Computing devices include hardware components that individually or collectively execute a wide variety of computing operations. For example, computing devices include processors, memory devices, transistors, peripheral device ports, and other hardware components. These hardware components interoperate to allow the computing device to perform computing operations such as presenting applications, storing data, facilitating digital communications, and any number of other operations. While particular reference is made to particular hardware components and particular computing operations, computing devices may include different and/or additional hardware components and may execute different and/or additional operations.

BRIEF DESCRIPTION OF THE DRAWINGS

[0002] The accompanying drawings illustrate various examples of the principles described herein and are part of the specification. The illustrated examples are given merely for illustration, and do not limit the scope of the claims.

[0003] Fig. 1 is a block diagram of a computing device cooling system with partition-mounted ducts, according to an example of the principles described herein.

[0004] Fig. 2 is a block diagram of a computing device cooling system with partition-mounted ducts, according to an example of the principles described herein. [0005] Fig. 3 depicts a computing device with a cooling system with partitionmounted ducts, according to an example of the principles described herein.

[0006] Fig. 4 depicts a computing device with a cooling system with partitionmounted ducts, according to an example of the principles described herein.

[0007] Fig. 5 depicts a computing device with a cooling system with partitionmounted ducts, according to an example of the principles described herein.

[0008] Fig. 6 depicts a computing device with a cooling system with partitionmounted ducts, according to an example of the principles described herein.

[0009] Fig. 7 depicts a computing device with a cooling system with partitionmounted ducts, according to an example of the principles described herein.

[0010] Fig. 8 depicts a computing device cooling system, according to an example of the principles described herein.

[0011] Fig. 9 is a diagrammatic representation of a portion of the computing device cooling system, according to an example of the principles described herein.

[0012] Fig. 10 is a diagrammatic representation of a portion of the computing device cooling system, according to an example of the principles described herein.

[0013] Fig. 11 is a diagrammatic representation of a portion of the computing device cooling system, according to an example of the principles described herein.

[0014] Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and/or implementations that coincide with the description; however, the description is not limited to the examples and/or implementations provided in the drawings. DETAILED DESCRIPTION

[0015] Computing devices are used by millions of people daily to carry out business, personal, and social operations and it is not uncommon for an individual to interact with multiple computing devices on a daily basis. To execute an intended function, computing devices include multiple hardware components. For example, memory devices include instructions executable by a processor. Processors retrieve these instructions to execute computing operations. A computer may include other hardware components such as transistors, resistors, additional memory devices, and specialized processing units to aid in the execution of intended computing functions. For example, a computing device may include a graphics processing unit (GPU) which renders graphics for displays on the computing device screen. Obviously, a computing device includes many more hardware components than those specifically enumerated.

[0016] Use of these hardware components generates heat within the computing device. If left unchecked, these hardware components may overheat and/or cause adjacent components within the computing device to overheat. Overheating may negatively impact hardware component and computing device functionality and performance and may even result in temporary malfunction or permanent failure of the hardware component and computing device. Accordingly, a computing device may include a fan or other cooling system to cool heat-generating components and the environment within the computing device.

[0017] However, cooling systems may be ill-equipped to handle the increased temperatures resulting from larger and more advanced hardware components. For example, to deliver increased graphics rendering and display, GPUs with increased functionality are being developed. In some examples, GPUs in development may be larger than existing GPUs. The increased functionality and size of these GPUs, as well as the increased functionality and size of other hardware components, increases the heat generated by such components. As such, existing cooling systems may be incapable of effectively cooling these larger and/or more technologically advanced components.

[0018] Moreover, it may be the case that existing cooling systems to not properly direct hot air away from the hardware components. For example, a fan may draw air from a heat-generating component, but may direct the heated air to an interior portion of the computing device enclosure where other hardware components may reside. Thus, the cooling system may heat, rather than cool, the other components of the computing device.

[0019] The present specification describes a computing device cooling system that addresses these and other issues. Specifically, the present computing device cooling system includes a fan assembly that is adjacent the heat-generating component and directs heated air to an exterior of the computing device enclosure, rather than towards the additional hardware components within the enclosure. The cooling system includes a partition to block heated air from being driven toward other hardware components such as a central processing unit (CPU) and memory devices. A duct, or conduit, is mounted on the partition and directs the heated air towards a vent panel in the enclosure. A fan is disposed within the duct and promotes an active air flow to draw the heated air from the heat-generating component towards the vent panel in the enclosure. This computing device cooling system helps prevent heated air from “pre-heating” other hardware components within the computing device enclosure.

[0020] Specifically, the present specification describes a computing device cooling system. The computing device cooling system includes a partition to be mounted on an interior of a computing device enclosure between a heatgenerating component and an additional hardware component of the computing device. The partition is to block heated air generated by the heat-generating component to a region of an interior of a computing device enclosure that retains the additional hardware component. A duct is formed on the partition to redirect heated air generated by the heat-generating component to an exterior of the computing device enclosure. [0021] According to the present specification, a computing device cooling system includes a partition to be mounted on an interior of a computing device enclosure between a heat-generating component and an additional hardware component of the computing device. The heat-generating component may exhaust hot air towards the additional hardware component. The partition is adjacent the heat-generating component and is to block heated air generated by the heat-generating device to a region of the interior of the computing device enclosure that retains the additional hardware component. The computing device cooling system includes a duct formed on the partition to redirect the heated air to an exterior of the computing device enclosure. A fan is disposed within the duct to draw the heated air from the heat-generating component to the exterior of the computing device enclosure.

[0022] The present specification also describes a computing device. The computing device includes an enclosure and a number of vents formed in the enclosure to allow air to be drawn into the enclosure. The computing device includes a GPU assembly disposed within the enclosure and a number of additional hardware components disposed within the enclosure. The GPU assembly includes a cooling system to exhaust hot air towards a number of additional hardware components. The computing device also includes a computing device cooling system disposed between the GPU assembly and the number of additional hardware components. The computing device cooling system includes a partition to block heated air generated by the GPU assembly from reaching a region within the enclosure that retains the number of additional hardware components. A duct is formed on the partition. The duct includes an inlet adjacent the GPU assembly and an outlet adjacent an exterior surface of the enclosure. A fan disposed within the duct redirects air from the GPU assembly towards the exterior surface of the enclosure.

[0023] Using such a computing device cooling system 1 ) blocks heated air from interacting with certain hardware components of a computing device; 2) actively draws the heated air away from a heat-generating component and towards an exterior of the computing device enclosure; 3) prevents pre-heating of the internal volume of the computing device enclosure; and 4) accommodates higher power and larger heat-generating components. However, it is contemplated that the devices and systems disclosed herein may address other matters and deficiencies in a number of technical areas, for example.

[0024] As used in the present specification and in the appended claims, the term “partition” refers to any physical surface upon which a duct is mounted and which partition includes a mounting interface to a computing device enclosure. In an example, the partition may be partially or wholly formed of a printed circuit board (PCB). However, in other examples, the partition may be another rigid substrate.

[0025] As used in the present specification and in the appended claims, the term “fan” refers to any air movement device and may include an axial fan, a centrifugal blower, or any other air movement device.

[0026] As used in the present specification and in the appended claims, the term, “controller” includes a processor and a memory device. The processor includes the circuitry to retrieve executable code from the memory and execute the executable code. As specific examples, the controller as described herein may include machine-readable storage medium, machine-readable storage medium and a processor, an application-specific integrated circuit (ASIC), a semiconductor-based microprocessor, and a field-programmable gate array (FPGA), and/or other hardware device.

[0027] As used in the present specification an in the appended claims, the term “memory” includes a non-transitory storage medium, which machine- readable storage medium may contain, or store machine-usable program code for use by or in connection with an instruction execution system, apparatus, or device. The memory may take many forms including volatile and non-volatile memory. For example, the memory may include Random-Access Memory (RAM), Read-Only Memory (ROM), optical memory disks, and magnetic disks, among others. The executable code may, when executed by the respective component, cause the component to implement the functionality described herein. The memory may include a single memory element or multiple memory elements. [0028] As used in the present specification and in the appended claims, the term “a number of” or similar language is meant to be understood broadly as any positive number including 1 to infinity.

[0029] Turning now to the figures, Fig. 1 is a block diagram of a computing device cooling system (100) with partition-mounted ducts (104), according to an example of the principles described herein. The computing device cooling system (100) may be disposed in different types of computing devices. For example, the computing device cooling system (100) may be found in a tower of a desktop computing device, a server computing device, or any other type of computing device.

[0030] The computing device cooling system (100) includes a partition (102). The partition (102) is mounted on an interior of a computing device enclosure, specifically between a heat-generating component (106) and an additional hardware component(s) (108) of the computing device. As described above, a computing device includes numerous additional hardware components (108). Components generate heat, with some components generating more heat than others. Exposure to hot air may negatively impact the operation of both the heat-generating component (106) and other additional hardware components (108) in the vicinity of the heat-generating component (106). As a particular example, the heat-generating component (106) may be a GPU. However, other components generate heat as well, such as memory devices and other processors.

[0031] Accordingly, the partition (102) blocks heated air generated by operation of a heat-generating component (106), which is disposed on one side of the partition (102), from interacting with, or pre-heating, an additional hardware component(s) (108) which are on the other side of the partition (102). That is, the partition (102) blocks heated air generated by the heat-generated component (106) from reaching a region of an interior of the computing device enclosure where the additional hardware component (108) is retained. Were the partition (102) not present this heated air may reach the additional hardware component (108) and pre-heat it as indicated by the dashed arrow in Fig. 1. The partition (102) may be adjacent the heat-generating component (106), for example, in an expansion slot next to the heat-generating component (106). [0032] The partition (102) and heat-generating component (106) may be mounted on the interior of the computing device in any number of ways. For example, the interior of the enclosure may include screw holes and the partition (102) may include corresponding holes through which a screw is inserted. The threads on a screw interact with the threading in the holes of the partition (102) and/or the threading in the holes on the interior of the enclosure to retain the partition (102) to the computing device.

[0033] In another example, the partition (102) may include an edge card connector to be inserted into a corresponding receptacle within the computing device enclosure. As a particular example, a mainboard (MB) or other printed circuit board within the computing device may include a peripheral component interconnect express (PCIe) slot. The partition (102) may include a PCIe connector that is inserted into the PCIe slot to affix the partition (102) within the computing device enclosure.

[0034] The partition (102) may be made of any variety of materials. For example, the partition (102) may be a printed circuit board (PCB) substrate, plastic substrate, metallic substrate, or glass substrate onto which the other components of the computing device cooling system (100) are mounted. In one particular example, the partition (102) may include a thermally insulating layer to, for example, prevent conduction of heat through the partition (102). That is, a side of the partition (102) facing the heat-generating component (106) may have an insulating layer or membrane disposed thereon. Such a thermally insulating layer may prevent conductive heat transfer from the heat generating component (106), through the partition (102), to the additional hardware component (108) on an opposite side of the partition (102).

[0035] A duct (104) is formed on the partition (102). The duct (104) is an air passage, or conduit, that directs the heated air as intended. Specifically, the duct (104) may have an inlet that is juxtaposed adjacent the heat-generating component (106) and an outlet that is juxtaposed adjacent an exterior surface of the enclosure. As such, the duct (104) re-directs heated air from the adjacent heat-generating component (106) to an exterior of the computing device enclosure as indicated by the solid arrows in Fig. 1 . Without such a re-directing duct (104), heated air may enter the region around the other computing device components, thus pre-heating the additional hardware components (108) which may negatively impact performance. Additionally, the pre-heating exacerbates any heating resultant from operation of the additional hardware components (108). Accordingly, a duct (104) disposed on a blocking partition (102) prevents convective heating of a region surrounding certain additional hardware components (108) of the computing device by re-directing heated air away from those certain additional hardware components (108).

[0036] As such, the present computing device cooling system (100) prevents conductive and convective heat transfer from the heat-generating component (106) to other components via the partition (102) which blocks air flow and impedes conductive heat transfer through the partition (102) and the duct (104) which re-directs the heated air towards the ambient atmosphere.

[0037] Fig. 2 is a block diagram of a computing device cooling system (100) with partition-mounted ducts (104), according to an example of the principles described herein. As described above, the computing device cooling system (100) includes a partition (102) which is mounted on an interior of a computing device enclosure (314) between a heat-generating component (106), such as a GPU, and an additional hardware component (108), such as a CPU or a memory device. As depicted in Fig. 2, the partition (102) is adjacent the heatgenerating component (106) and is to block exhaust air from the heatgenerating component (106) from entering a region of the interior of the computing device enclosure that retains the additional hardware components (108).

[0038] In the example depicted in Fig. 2, the computing device cooling system (100) includes additional hardware components (108). For example, the computing device cooling system (100) may include a fan (210) disposed within the duct (104). The fan (210) draws heated air from the adjacent heatgenerating component (106) to the exterior of the computing device enclosure as depicted by the solid arrow in Fig. 2. This active air flow increases the cooling of the computing device and the prevention of any pre-heating of the internal volume of the computing device that may occur. That is, were such a fan (210) not present, the heated air may remain within the internal volume of the computing device enclosure and may not be expelled as desired. Accordingly, the fan (210) generates a pressure differential that draws air into the inlet of the duct (104) and expels it at the outlet of the duct (104), which outlet is at an exterior of the computing device enclosure. As such, heat dissipation is further enhanced via the fan (210) which promotes active flow of the heated air flow from the internal cavity of the enclosure towards an exterior environment.

[0039] Fig. 3 depicts a computing device (312) with a computing device cooling system (100) with partition-mounted ducts (104), according to an example of the principles described herein. As described above, computing devices (312) include additional hardware components (108) within the enclosure (314) that work to deliver computing functionality to a user. Examples of such additional hardware components (108) include memory devices (316), a GPU (318), and a CPU, which may be found under a CPU cooling system (320) depicted in Fig 3. Each of these hardware components generate heat that elevate the overall temperature within the enclosure (314). Some of these components may generate large amounts of heat. If the internal temperature within the enclosure (314) is allowed to become too great, these components may overheat or otherwise lose their ability to perform their intended function. As described above, the present computing device cooling system (100) alleviates these conditions, and is robust enough to cool larger components such as high-performance GPUs (318). That is, as depicted in Fig. 3, a computing device (312) may include a GPU (318) that extends a width of an interior of the computing device enclosure (314). The computing device cooling system (100) facilitates cooling of these larger components and protects the additional hardware components (108) from the heated air that results from the operation of the GPU (318).

[0040] As depicted in Fig. 3, the computing device cooling system (100) is disposed between the GPU (318) and a number of additional hardware components (108) such as the CPU and the memory device (316). Specifically, Fig. 3 depicts the partition (102) which divides the GPU (318), or other heatgenerating component (106), from other components to block the heated air from the GPU (318) from reaching the number of additional hardware components (108). As such, heat generated by the GPU (318) or other heatgenerating component (106) does not unduly pre-heat the other components. [0041] As described above, the partition (102) may be mounted to the enclosure (314) and may be adjacent the heat-generating component (106). That is, a computing device enclosure (314) may include expansion slots into which different hardware components may be inserted. The partition (102) may be inserted into one of these expansion slots.

[0042] As another example, a bulkhead of the enclosure (314) may include threaded holes and the partition (102) may include through holes. A screw may pass through the partition (102) through hole such that the threads of the screw interface with the thread holes to hold the partition (102) in place.

[0043] As another example, the partition (102) may include a card edge connector. In this example, there may be a circuit board within the enclosure (314) that includes a receptacle for the edge card connector. In this example, this card edge connector and receptacle may also provide an electrical interface to direct power and control signals from a controller (322) to the fan (210) of the computing device cooling system (100). While particular reference is made to particular ways in which the partition (102) may be mounted within the enclosure (314), i.e. , within an expansion slot, to a bulkhead of the enclosure (314), or within an electrical interface slot, and adjacent the heat-generating component (106), there may be other mechanical interfaces by which the partition (102) is mounted within the enclosure (314).

[0044] In the example depicted in Fig. 3, the interior of the computing device enclosure (314) may have a length that is greater than a length of the partition (102). Specifically, as depicted in Fig. 3, the partition (102) may have a length and width that approximately match the length and the width of the heatgenerating component (106). As such, any heat that conductively emanates from the GPU (318) is blocked by the similarly shaped and sized partition (102). [0045] Fig. 2 also depicts the duct (104) formed on the partition (102) which includes an inlet adjacent the GPU (318) and an outlet that is adjacent an exterior surface of the enclosure (314). Fig. 2 also depicts the fan (210) that is disposed within the duct (104) and is to operate to direct heated air generated by the GPU (318) towards a side vent (not pictured). In so doing, the duct (104)/fan (210) assembly prevents the movement of heated air towards the CPU and memory devices (316) that are found on the opposite side of the partition (102).

[0046] Fig. 3 also depicts a controller (322) which selectively activates the fan (210). That is, in some cases, the fan (210) may be continuously operated. In other examples, the fan (210) may be turned on and off to selectively cool the internal volume of the enclosure (314). Doing so may conserve power. For example, there may be times, such as when the internal volume of the enclosure (314) is below a predetermined temperature or when the computing device (312) is in a sleep state, when the components are sufficiently cool. In these situations, to conserve power, the fan (210) may be shut down.

[0047] As another example, the controller (322) may control a fan (210) speed. For example, if the temperature within the enclosure (314) or a temperature of a heat-generating component (106) or another component is greater than a first threshold, the controller (322) may operate the fan (210) at a first speed. By comparison, if the temperature within the enclosure (314), a temperature of the heat-generating component (106), or the temperature of another component is greater than a second threshold, which is greater than the first threshold, the controller (322) may increase the fan (210) speed to a second speed to increase the rate of air withdrawal to promote even more cooling.

[0048] In some examples, control of the fan (210) speed may be based on the load of the heat-generating component (106) or the overall load of the computing device (312). For example, the fan (210) may be run at a low speed when the computing device (312) is lightly loaded or idle and may be run at a high speed when the different components are more highly loaded. [0049] As such, the controller (322) may selectively turn the fan (210) on and off and selectively control the fan (210) speed based on a temperature within the interior of the computing device enclosure (314), power draw, or load on the heat-generating component (106). While particular reference is made to particular triggers for selective activation and/or control of the fan (210), other triggers may be implemented in accordance with the principles described herein.

[0050] The controller (322) may be positioned in different locations within the computing device cooling system (100). In one example, the controller (322) may be positioned on the partition (102) as depicted in Fig. 11. In this example, an electrical interface to deliver control signals to and from the fan (210) may include electrical leads on the surface of the partition (102) or embedded within the partition (102).

[0051] In another example, the controller (322) may be located at another location within the enclosure (314). For example, the controller (322) may be located on another circuit board, such as a mainboard. In an example, temperature sensors which measure the temperatures which trigger the selective activation of the fan (210) are disposed on this mainboard as depicted in Fig. 9 and/or may be disposed on the partition (102) as depicted in Fig. 10. [0052] When the fan (210) is disposed on a separate structure (i.e. , partition (102) as compared to the controller (322) (i.e., the mainboard), the electrical interface may include additional hardware components to route power and control signals from the controller (322) to the fan (210). In one example, the electrical interface may be a PCIe connection on the partition (102) that mates with a PCIe slot on the mainboard. A PCIe slot may have a main connector and an additional connector, referred to as a side band connector. In this example, the side band connector may be used to transmit power and control signals to the fan (210) from the controller (322). In the example where the partition (102) includes a temperature sensor, the temperature data may be transmitted form the sensors on the partition (102) to the controller (322). In this example, the electrical interface that is a PCIe connector which is plugged into a PCIe slot may also provide mechanical support for the partition (102) and the components disposed thereon.

[0053] As another example, the electrical interface may include a wired connection, that is not a PCIe connector. In this example, the wired connection may be manually plugged into the mainboard. As yet another example, the electrical interface may include a blind-mate connector that automatically is mated to a header/receptacle on the mainboard when the partition (102) is mounted in the computing device enclosure (314). This may be performed using a wired connector that is retained by mechanical structures on the partition (102).

[0054] In yet another example, the electrical interface may be a custom, non- PCIe card-edge connector that is mated when the partition (102) is installed in the computing device (312). While particular reference is made to particular electrical interfaces, the computing device cooling system (100) may include any variety of electrical interfaces to connect the fan (210) to a controller (322) that is either on the partition (102) or another substrate.

[0055] Fig. 3 also depicts the vents (324-1 , 324-2) formed within the enclosure (314) that allow air to be drawn into the enclosure (314) and expelled from the enclosure (314). That is, the computing device cooling system (100) relies on air flow to 1 ) draw fresh air that is at a lower temperature than the heat-generating components (106) and 2) expel the heated air towards the external environment. Accordingly, the vents (324) facilitate circulation of air through the computing device enclosure (314) to cool the internal components. [0056] Fig. 4 depicts a computing device (312) with a computing device cooling system (100) with partition-mounted ducts (104), according to an example of the principles described herein. Specifically, Fig. 4 depicts the computing device enclosure (314) with a side panel installed. As described above, action of the fan (210) draws heated air away from the internal volume of the computing device enclosure (314). Airflow may be directed through vents (324-2, 324-3) in the enclosure (314). Specifically, heated air is exhausted through a side vent (324-3) while ambient air is introduced through a front vent (324-2) to supply the components with fresh air that is cooler than an internal volume air temperature. While Fig. 4 depicts vents (324) in particular locations, vents (324) may be located at other locations, such as a bottom surface of the enclosure (314) as depicted in Fig. 7. Accordingly, the enclosure (314) promotes the active cooling of the hardware components of the computing device (312) by providing ample sources of fresh air and an outlet for the heated air.

[0057] Fig. 5 depicts a computing device (312) with a computing device cooling system (100) with partition-mounted ducts (104), according to an example of the principles described herein. In the example depicted in Fig. 5, the computing device cooling system (100) further includes a wall extending perpendicularly away from an end surface of the partition (102) towards the heat-generating component, (e.g., GPU (318)). Such an extending wall may further prevent the pre-heating of other components and provide a more targeted re-direction of the heated air away from the other components and towards an exterior of the computing device enclosure (314). Specifically, along with the partition (102) main body, the heat-generating component (106) surfaces, and the side panels of the enclosure (314), the perpendicular wall generates a closed volume to retain the heated air. As depicted in Fig. 4 and 7, the closed volume may be exposed to the environment via the vents (324). Accordingly, any heated air does not escape the closed volume, except through the vents (324) to the ambient environment. As described above, the extending perpendicular wall may be layered with an insulating material to prevent conductive radiation through the partition (102).

[0058] Fig. 6 depicts a computing device (312) with a computing device cooling system (100) with partition-mounted ducts (104), according to an example of the principles described herein. In the example depicted in Fig. 6, the partition (102) extends a full length and full width of the interior of the computing device enclosure (314). As such, the partition (102) creates a closed volume that encloses and isolates the heat-generating component (106) from other components of the computing device (312). As with the extending wall depicted in Fig. 5, a partition (102) that fills the cross-sectional area of the enclosure (314) may further prevent the pre-heating of other components and provide a more targeted re-direction of the heated air away from the other components and towards an exterior of the computing device enclosure (314). Specifically, along with the heat-generating component (106) surfaces and the side panels of the enclosure (314), the partition (102) main body forms a closed volume to retain the heated air. As depicted in Fig. 4 and 7, the generated closed volume may be exposed to the environment via the vents (324). Accordingly, any heated air does not escape the closed volume, except through the vents (324) to the ambient environment.

[0059] Fig. 7 depicts a computing device (312) with a computing device cooling system (100) with partition-mounted ducts (104), according to an example of the principles described herein. Specifically, Fig. 7 depicts the computing device (312) laying horizontal to illustrate yet another vent (324-1) disposed on another surface of the enclosure (314). As described, the vents (324) provide the computing device (312) with fresh air that is room temperature, which may be cooler than the air surrounding heat-generating components (106), and thus adds to the cooling effect of the computing device cooling system (100). The vents (324) also provide an outlet through which heated air is expelled from the enclosure (314). For example, the inlets to the ducts (104) may be adjacent the heat-generating component (106), which heatgenerating component (106) has been omitted from Fig. 7 to allow depiction of the inlets. The outlets of the ducts (104) may be adjacent the exterior surfaces. Accordingly, the heat-generating components (106) have access to fresh air from vents (324) and can expel heated air through the vents (324).

[0060] In some examples, the ducts (104) are re-directing ducts (104) that generate an outlet flow that is perpendicular to the inlet flow. That is, as depicted in Fig. 7, air at the inlet may have a vertical flow and air at the outlet may be expelled horizontally. Accordingly, the ducts (104) actively re-direct heated air away from the other components of the computing device (312) and towards an exterior where the air is vented to the environment.

[0061] As depicted in Fig. 7, the computing device cooling system (100) may include multiple ducts (104). Each duct (104) may have a fan (210) to draw air through a respective duct (104). For simplicity in illustration, a single duct (104) and fan (210) are depicted with a reference number and air flow is depicted through a subset of the depicted ducts (104) and fans (210).

[0062] As further depicted in Fig. 7, each duct (104) may be directed towards different exterior surfaces of the computing device enclosure (314). As such, rather than directing all heated air to a localized region, the heated air is more evenly distributed to the exterior environment, thus cooling the heated air more quickly. As the air immediately surrounding the enclosure (314) is the air that is drawn into the enclosure (314) by the fans (210), cooler environmental air increases the cooling effect of the computing device cooling system (100). Thus, the distributed expulsion of heated air to a larger region provides cooler environmental air which is drawn into the computing device enclosure (314).

[0063] Fig. 8 depicts a computing device cooling system (100), according to an example of the principles described herein. Specifically, Fig. 8 depicts the partition (102), ducts (104), and fans (210) that redirect heated air towards an exterior environment of the computing device enclosure (314). Again, for simplicity in representation, a single instance of a duct (104) and a fan (210) is represented with a reference number.

[0064] Fig. 8 also depicts an example electrical interface (826). In this particular example, the electrical interface (826) is a PCIe card edge connector that is received in a corresponding PCIe slot on a mainboard (828). In this example, the electrical interface (826) may also serve as the mechanical interface that affixes the partition (102) to the computing device enclosure (314). [0065] Fig. 8 also depicts other examples of mechanical interfaces that attach the computing device cooling system (100) to the enclosure (314). For example, the mechanical interface may include a rear mounting bracket (830) which includes threaded or unthreaded holes that align with a threaded hole on the enclosure (314). Accordingly, via a screw inserted through the hole of the rear mounting bracket (830) and engaged with the threaded hole on the enclosure (314), the computing device cooling system (100) is affixed to the enclosure (314). In this example, the rear mounting bracket (830) may be any shape and size to facilitate securing the computing device cooling system (100) to the enclosure (314). In the example depicted in Fig. 8, the rear mounting bracket (830) has a PCIe mounting bracket and may align with a corresponding structure on the enclosure (314). In the event that the computing device cooling system (100) has a rear-facing duct (104)/fan (210) as depicted in Fig. 8, the rear mounting bracket (830) may be vented as indicated in Fig. 8.

[0066] Fig. 8 also depicts another example of a mechanical interface which is a front mounting bracket (832). Similar to the rear mounting bracket (830), the front mounting bracket (832) may include threaded or unthreaded holes that align with and affix the computing device cooling system (100) to the enclosure (314) when mated with a threaded hole on the enclosure (314) and a screw. While particular reference is made to threaded holes and screws, the computing device cooling system (100) may be affixed to the enclosure (314) using other devices.

[0067] As with the rear mounting bracket (830), the front mounting bracket (832) may be any shape and size to facilitate securing the computing device cooling system (100) to the enclosure (314) and may be a PCIe mounting bracket to align with a corresponding structure on the enclosure (314).

[0068] In some examples, the ducts (104) may be re-positionable to redirect the heated air in different directions relative to an intake of the duct (104). That is, different environments of the computing device (312) as well as different enclosure component layouts may dictate air be directed towards different vents (324). For example, a computing device enclosure (314) may be set against a wall or other vertical surface such that a rear vent (324) is blocked or for which there is a small gap between the rear vent and the vertical surface. In this example, a duct (104) for which the outflow is directed towards the rear vent may be rotated such that the outflow is directed to a side vent, which is not blocked. Such adjustability may include a duct (104) that rotates about a fixed point on the partition (102). In another example, the partition (102) may include multiple mounting locations such that the duct (104)/fan (210) assembly may be re-positioned on the partition (102).

[0069] Fig. 9 is a diagrammatic representation of a portion of the computing device cooling system (100), according to an example of the principles described herein. Specifically, Fig. 9 depicts the controller (322) of the computing device cooling system (100). As described above, rather than being continually powered on, in some examples the fan (210) is intermittently activated based on any number of triggers. The controller (322) provides this selective activation and control.

[0070] The controller (322) may be located on different structural elements of the computing device (312). In one example as depicted in Fig. 9, the controller (322) may be on a mainboard (828) of the computing device (312). In this example, the control signal is routed to the fan (210) via the electrical interface (826) as described above.

[0071] Fig. 9 also depicts additional hardware components of the computing device cooling system (100). Specifically, in an example, the computing device cooling system (100) may include a temperature sensor (934) or multiple temperature sensors (934) which trigger activation of the fan (210). This detected temperature is passed to the controller (322) which bases selective activation on a detected temperature. For example, when the particular temperature is greater than a threshold amount, the controller (322) may activate the fans (210). By comparison, when the particular temperature is below a threshold amount, the controller (322) may de-activate the fans (210) or maintain the fans (210) in a de-activated state.

[0072] As described above, in addition to selectively activating the fan (210) based on a detected temperature, the controller (322) may selectively alter the fan (210) speed based on a detected temperature, with higher temperatures triggering higher fan (210) speeds. As with the controller (322), the temperature sensor(s) (934) may be mounted on different structural elements of the computing device (312). In the example depicted in Fig. 9, the temperature sensor (934) is disposed on the mainboard (828) to which the partition (102) is mounted. Note that the computing device cooling system (100) may include one or multiple temperature sensors (934) throughout the computing device (312) to detect the blower-triggering conditions.

[0073] In addition to the fans (210) that draw air from a heat-generating component (106), the computing device (312) may include mainboard fans (936) that similarly draw heat away from other components within the enclosure (314).

[0074] Fig. 10 is a diagrammatic representation of a portion of the computing device cooling system (100), according to an example of the principles described herein. In the example depicted in Fig. 10, the controller (322) and some temperature sensors (934) are disposed on the mainboard (828). Note that the mainboard fans (936) have been omitted from Fig. 10 to allow for more clear illustration of other elements.

[0075] In this example, additional temperature sensor(s) (934) are disposed on the partition (102). In this example, sensor readings from the temperature sensors (934) on the partition (102) are passed to the controller (322) via the electrical interface (826). Similar to as described above in connection with Fig. 9, the control signals are routed from the controller (322) to the fans (210) via the electrical interface (826) as described above.

[0076] Fig. 11 is a diagrammatic representation of a portion of the computing device cooling system (100), according to an example of the principles described herein. In the example depicted in Fig. 11 , in addition to a controller (322), the computing device may include a mainboard controller (1138). In this example, the mainboard controller (1138) may control the mainboard fans (936) and the controller (322) on the partition (102) may control the fans (210) on the partition (102). In this example, the controller (322) may be connected to the mainboard controller (1138) such that the computing device may present a coordinated effort between the mainboard fans (936) and the fans (210) on the partition (102) to cool the components within the enclosure (314).

[0077] Using such a computing device cooling system 1) blocks heated air from interacting with certain hardware components of a computing device; 2) actively draws the heated air away from a heat-generating component (106) and towards an exterior of the computing device enclosure; 3) prevents pre-heating of the internal volume of the computing device enclosure; and 4) accommodates higher power and larger heat-generating components (106). However, it is contemplated that the devices and systems disclosed herein may address other matters and deficiencies in a number of technical areas, for example.