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Title:
PASTE ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/167824
Kind Code:
A1
Abstract:
A paste adhesive composition which contains silver particles and a monomer, and forms a silver particle-linking structure in which the interfaces between the silver particles have been eliminated by a heat treatment, wherein: the silver particles include flake-shaped silver particles and spherical silver particles; and when the paste adhesive composition is heated from a temperature of 30°C to 200°C at a temperature increase rate of 10°C/minute, then subjected to a heat treatment at 200°C for 60 minutes, then heated from 200°C to 450°C at a temperature increase rate of 10°C/minute, and then subjected to a heat treatment at 450°C for 10 minutes, (W2-W1)/W2 equals 0.20-0.90, inclusive, relative to the paste adhesive composition before heating under the stated measurement conditions, when W1(%) is the percentage of the weight loss of the paste adhesive composition after the heat treatment at 200°C for 60 minutes, and W2(%) is the percentage of the weight loss of the paste adhesive composition after the heat treatment at 450°C for 10 minutes. As measurement conditions, the measurement method is a thermogravimetry-differential thermal analysis (TG-DTA) device, and the atmosphere is an atmospheric air environment.

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Inventors:
NISHI TAKAYUKI (JP)
KAGOMIYA KOKI (JP)
KUSAKA KEIICHI (JP)
Application Number:
PCT/JP2019/006717
Publication Date:
September 06, 2019
Filing Date:
February 22, 2019
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C09J201/00; C08F20/00; C08G59/20; C09J4/02; C09J9/02; C09J11/04; C09J11/06; C09J133/00; C09J163/00; C09J171/00; H01B1/00; H01B1/22; H01L21/52
Domestic Patent References:
WO2018034234A12018-02-22
WO2012165375A12012-12-06
Foreign References:
JP2017019904A2017-01-26
JP2008166841A2008-07-17
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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