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Title:
PASTE COMPOSITION, DIELECTRIC COMPOSITION, CAPACITOR, AND METHOD FOR MANUFACTURING DIELECTRIC COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/084981
Kind Code:
A1
Abstract:
This disclosed paste composition contains an inorganic filler, a phenoxy resin, and a solvent. The paste composition does not contain a cross-linking agent for the phenoxy resin. The content ratio of a specific resin that is a resin other than the phenoxy resin in the resin included in the paste composition is 40% or less by mass.

Inventors:
HATTORI TAKAYUKI
HOGIRI MASAYUKI
OHBAYASHI TAKASHI
NAGASAKI YOSHIHISA
Application Number:
PCT/JP2020/036044
Publication Date:
May 06, 2021
Filing Date:
September 24, 2020
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C04B35/468; C04B35/634; C08K3/01; C08L71/10; C08L75/04; H01B3/00; H01G4/20; H01G4/30; H01G4/33
Foreign References:
JP2017528549A2017-09-28
JP2007217623A2007-08-30
JP2006210911A2006-08-10
JP2018516755A2018-06-28
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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