Title:
PASTE COMPOSITION FOR FILLING THROUGH HOLE AND PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/118827
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a hole-filling paste composition with excellent adhesion to metal plating layers and favorable hole-filling properties, and a printed wiring board wherein adhesion between the cured paste and the metal plating layer is favorable. For said purpose, a hole-filling paste composition, which comprises, with respect to 100 parts by mass of epoxy resin, 1.5 - 20 parts by mass of a modified imidazole curing agent, 50 - 200 parts by mass of dendritic copper powder with tap density of 4.0 g/cm3 or more, and 20 - 200 parts by mass of at least one kind of inorganic filler selected from a group consisting of barium sulfate, calcium carbonate and silica, is used.
Inventors:
UMEDA HIROAKI (JP)
TAKAMI KOUJI (JP)
MATSUDA KAZUHIRO (JP)
TAKAMI KOUJI (JP)
MATSUDA KAZUHIRO (JP)
Application Number:
PCT/JP2015/000288
Publication Date:
August 13, 2015
Filing Date:
January 22, 2015
Export Citation:
Assignee:
TATSUTA DENSEN KK (JP)
International Classes:
C08L63/00; C08G59/50; C08K3/26; C08K3/30; C08K7/06; C08K9/04; C09D17/00; H05K1/09; H05K1/11
Domestic Patent References:
| WO2006118091A1 | 2006-11-09 |
Foreign References:
| JP2007305576A | 2007-11-22 | |||
| JP2005203764A | 2005-07-28 | |||
| JPH10147801A | 1998-06-02 |
Attorney, Agent or Firm:
TSUTADA, Masato et al. (JP)
Masato Tsutada (JP)
Masato Tsutada (JP)
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