Title:
PASTE FOR HIGH TEMPERATURE BAKING
Document Type and Number:
WIPO Patent Application WO/1991/015018
Kind Code:
A1
Abstract:
An inexpensive conductive composition having high electric conductivity, high oxidation resistance, high migration resistance, excellent solder wettability and high resistance to corrosion due to the action of solder and long shelf life. The conductive composition is expressed by the general formula AgxCuyMz (where M is at least one metal selected from the group consisting of Bi, Pb and Zn; and x, y and z represent an atomic ratio, and satisfy the relation x+y+z = 1, 0.001 x 0.4, 0.6 y 0.999, 0 z 0.05). The composition is made of copper alloy powder, glass frit and organic vehicle. Particles of the copper alloy have a higher silver concentration at surface than the mean silver concentration, and they include regions in which the silver concentration increases towards the surface. The invention discloses also a paste for screen printing, a paste for a conductive circuit, a paste for an electrode, a paste for electromagnetic wave shielding and a conductive paste for resistance contact, each containing the composition described above.
Inventors:
YOKOYAMA AKINORI (JP)
KATSUMATA TSUTOMU (JP)
NAKAJIMA HITOSHI (JP)
KATSUMATA TSUTOMU (JP)
NAKAJIMA HITOSHI (JP)
Application Number:
PCT/JP1991/000363
Publication Date:
October 03, 1991
Filing Date:
March 18, 1991
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
B22F1/17; C22C32/00; H01B1/02; H01B1/16; H01C17/28; H01G4/008; H05K1/09; H01B1/22; H05K9/00; (IPC1-7): B22F1/00; C22C9/00; H01B1/16; H01B1/22; H01G1/01; H05K1/09; H05K9/00
Foreign References:
| JPS53101687A | 1978-09-05 |
Other References:
See also references of EP 0474879A4
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