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Title:
PASTE POLYMERIZATION INITIATOR COMPOSITION, DENTAL OR SURGICAL ADHESIVE AND ADHESIVE KIT
Document Type and Number:
WIPO Patent Application WO/2003/082931
Kind Code:
A1
Abstract:
A paste polymerization initiator composition comprising 100 pts.wt. of an organic boron compound (A) being liquid at 25 ° C and 4 to 400 pts.wt. of particles of 0.001 to 50 μm average diameter (B) being inert to the organic boron compound (A), the paste polymerization initiator composition having a consistency at 25 ° C, as measured under a load of 300 g in accordance with the method specified in ISO 4823, of 15 to 100 mm. This composition constitutes, for example, a dental kit together with a separately packaged polymerizable monomer. This composition enables safely using organic boron compounds, and further its use is very easy because of paste form.

Inventors:
TOMIKAWA TAMOTSU (JP)
ZENG WEIPING (JP)
Application Number:
PCT/JP2003/003020
Publication Date:
October 09, 2003
Filing Date:
March 13, 2003
Export Citation:
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Assignee:
SUN MEDICAL CO LTD (JP)
TOMIKAWA TAMOTSU (JP)
ZENG WEIPING (JP)
International Classes:
A61K6/00; A61K6/083; C08F4/52; (IPC1-7): C08F4/52; A61K6/00; A61K6/083; A61L24/00
Domestic Patent References:
WO1994024985A11994-11-10
Foreign References:
JPH03264509A1991-11-25
JPH07291819A1995-11-07
JP2001019605A2001-01-23
JP2001139411A2001-05-22
JPH05154168A1993-06-22
JPH09110913A1997-04-28
JPS4811892A
JPS5884803A1983-05-21
Other References:
See also references of EP 1489103A4
Attorney, Agent or Firm:
Suzuki, Shunichiro (13-6 Nishigotanda 7-chome Shinagawa-ku, Tokyo, JP)
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