Title:
PASTE THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR COMPONENT, SEMICONDUCTOR MOUNTED ARTICLE, METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2017/110052
Kind Code:
A1
Abstract:
Provided is a paste thermosetting resin composition which does not inhibit melting and aggregation of a soldering powder during soldering. This paste thermosetting resin composition contains a soldering powder, a thermosetting resin binder, an activator, and a thixotropic additive, the melting point of the soldering powder being 100°C to 240°C, and the thermosetting resin binder including a bifunctional or greater oxetane compound and/or a benzoxazine compound having two or more benzoxazine rings.
Inventors:
FUKUHARA YASUO
YAMAGUCHI ATSUSHI
YAMAGUCHI ATSUSHI
Application Number:
PCT/JP2016/005062
Publication Date:
June 29, 2017
Filing Date:
December 06, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B23K35/363; C08G65/18; H01B1/22; H01L21/60
Domestic Patent References:
| WO2012160722A1 | 2012-11-29 |
Foreign References:
| JP2006015348A | 2006-01-19 | |||
| JP2004202518A | 2004-07-22 | |||
| JP2006057007A | 2006-03-02 |
Attorney, Agent or Firm:
KAMATA, Kenji et al. (JP)
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