Title:
PASTED BASE BOARD CUTTING SYSTEM AND BASE BOARD CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO2004007164
Kind Code:
A8
Abstract:
A cutting device (400) has a first cutting device (410) opposed to a first base board, and a second cutting device (420) opposed to a second base board. The first cutting device (411) has a cutter wheel (412) for forming a scribe line in the first base board, and a break roller (416) for penetrating the scribe line thickness-wise of the first base board. The second cutting device (430) likewise has a cutter wheel (412) for forming a scribe line in the second base board, and a break roller (416) for penetrating the scribe line thickness-wise of the second base board. The first cutting device (410) has a backup roller (414) opposed to the break roller (416) of the second cutting device (430) and pressed against the first base board surface, while the second cutting device (430) also has a similar backup roller (414).
More Like This:
| JP5357122 | Methods and equipment for cutting single crystals |
| JPH11192616 | DIVIDING APPARATUS |
| JP6481465 | How to break a composite board |
Inventors:
OKAJIMA YASUTOMO (JP)
NISHIO YOSHITAKA (JP)
NISHIO YOSHITAKA (JP)
Application Number:
PCT/JP2003/008449
Publication Date:
January 20, 2005
Filing Date:
July 02, 2003
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
OKAJIMA YASUTOMO (JP)
NISHIO YOSHITAKA (JP)
OKAJIMA YASUTOMO (JP)
NISHIO YOSHITAKA (JP)
International Classes:
B28D5/00; B65G49/06; C03B33/02; C03B33/027; C03B33/03; C03B33/033; C03B33/07; (IPC1-7): B28D5/00; C03B33/03
Download PDF: