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Title:
PASTY PREMIX OF GEL FOOD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/158596
Kind Code:
A1
Abstract:
Provided are a pasty premix, from which a smooth and delicious gel food can be easily prepared simply by mixing with an aqueous medium and heating and which can be distributed at normal temperature over a long period of time, and a method for manufacturing the same. The premix of a gel food, said premix being to be mixed with an aqueous medium and then cooked to thereby prepare a gel food, is characterized by containing a saccharide and a starch, having a high sugar content and being pasty. The method for manufacturing the premix comprises heat-sterilizing a composition that contains a saccharide and a starch.

Inventors:
TAKADA Kazuaki (3-2, Toyo 6-chome, Koto-k, Tokyo 16, 〒1350016, JP)
KOMAZAKI Hitoshi (3-2, Toyo 6-chome, Koto-k, Tokyo 16, 〒1350016, JP)
ITO Kaoru (3-2, Toyo 6-chome, Koto-k, Tokyo 16, 〒1350016, JP)
KANBE Haruna (3-2, Toyo 6-chome, Koto-k, Tokyo 16, 〒1350016, JP)
Application Number:
JP2016/059107
Publication Date:
October 06, 2016
Filing Date:
March 23, 2016
Export Citation:
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Assignee:
SONTON HOLDINGS CO., LTD. (3-2 Toyo 6-chome, Koto-ku Tokyo, 16, 〒1350016, JP)
International Classes:
A23L29/212; A23C13/12; A23L9/00; A23L29/30; A23G1/00; A23G1/30; A23L21/10
Foreign References:
JPH10295268A1998-11-10
JPS6232839A1987-02-12
JP2001314149A2001-11-13
JP2008086218A2008-04-17
JPH07115925A1995-05-09
CN102696731A2012-10-03
Other References:
LI J.Y. ET AL.: "Relationships between thermal, rheological characteristics and swelling power for various starches.", JOURNAL OF FOOD ENGINEERING, vol. 50, no. 3, 2001, pages 141 - 148, XP055319897, ISSN: 0260-8774
YUZO ITO ET AL.: "Denpun Ryushi no Kozo -Kakushu Denpun no Bojundo to Yokaido", KUSHIRO RONSHU REPORTS OF HOKKAIDO UNIVERSITY OF EDUCATION AT KUSHIRO, 1989, pages 67 - 76, ISSN: 0287-8216
Attorney, Agent or Firm:
HIRAKI Yusuke et al. (Atago Green Hills MORI Tower 32F, 5-1 Atago 2-chome, Minato-k, Tokyo 32, 〒1056232, JP)
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