Title:
PATTERN COATING METHOD USING SURFACE TENSION AND DENSITY, AND APPARATUS THEREOF
Document Type and Number:
WIPO Patent Application WO/2013/018956
Kind Code:
A1
Abstract:
The present invention relates to a coating method for forming patterns on the surface of a substrate such as a plastic film, and the like, and specifically, to a method for forming patterns on the surface of a substrate by using properties such as the viscosity of a coating liquid and the surface tension of the substrate to be coated and the coating liquid, unlike an existing wet gravure coating method or a dry coating method using a patterned mold. The coating method of the present invention does not use an organic solvent unlike the wet gravure coating method nor needs a mold unlike the dry coating method using a mold. The present invention provides a method capable of very efficient pattern coating by naturally forming patterns on the surface of the substrate by using properties such as surface tension and density of the substrate and the coating liquid.
Inventors:
KIM CHANG KUN (KR)
Application Number:
PCT/KR2011/008394
Publication Date:
February 07, 2013
Filing Date:
November 07, 2011
Export Citation:
Assignee:
KIM CHANG KUN (KR)
International Classes:
B05D1/38; B05C1/00; B05D3/06
Foreign References:
| JP2011014829A | 2011-01-20 | |||
| KR100987733B1 | 2010-10-13 | |||
| JP2004098017A | 2004-04-02 | |||
| JP2002201387A | 2002-07-19 |
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Claims: