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Title:
PATTERN EVALUATION METHOD, DEVICE THEREFOR, AND ELECTRON BEAM DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/013342
Kind Code:
A1
Abstract:
Disclosed is a pattern evaluation device which determines the irregularities of the surface of a sample and measures the dimension thereof using the parallax induced by a beam tilt, wherein the amount of an astigmatic difference or the amount of focus displacement is calculated from the amounts of pattern displacement before and after the beam tilt after being corrected by the amount of displacement that depends on the amount of beam deflection for moving the position of image acquisition. Specifically disclosed is a pattern evaluation device which, when acquiring one SEM image, continuously changes the angle of incidence of primary electrons, and acquires an image in which the regions obtained at different angles of incidence within the same image are continuously connected, thereby determining the irregularities on the basis of the acquisition of the one image.

Inventors:
YAMANASHI HIROMASA (JP)
SOHDA YASUNARI (JP)
OHASHI TAKEYOSHI (JP)
FUKUDA MUNEYUKI (JP)
Application Number:
PCT/JP2010/004743
Publication Date:
February 03, 2011
Filing Date:
July 26, 2010
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP (JP)
YAMANASHI HIROMASA (JP)
SOHDA YASUNARI (JP)
OHASHI TAKEYOSHI (JP)
FUKUDA MUNEYUKI (JP)
International Classes:
H01J37/22; G01B15/00; H01J37/147; H01J37/21; H01J37/28; H01L21/66
Foreign References:
JP2005310602A2005-11-04
JP2008084626A2008-04-10
JP2007208039A2007-08-16
JP2003090719A2003-03-28
JP2008198405A2008-08-28
JP2003016983A2003-01-17
JP2001273861A2001-10-05
Attorney, Agent or Firm:
POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)
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