PATTERN FILM FORMING DEVICE

WIPO Patent Application WO/2016/204204

A1

Provided is a pattern film forming device that, when intermittently conveying a flexible band-like substrate, is capable of suitably detecting substrate markers provided on the substrate at a pattern processing position.　The pattern film forming device (1) is equipped with thin-film forming units (10X), (10Y) each having a first imaging unit (15) for imaging substrate markers provided in each processing region on a substrate (2) and second imaging units (16a), (16b) for imaging the substrate markers at the pattern processing position. A control unit calculates the conveyance distance to the pattern processing position on the basis of the detection results from the first imaging unit (15). By controlling drive rollers (12) on the basis of the conveyance distance, the processing regions corresponding to the substrate markers are conveyed to the pattern processing position, and by controlling a material ejecting unit (17) and a mask (18) on the basis of the detection results from the second imaging units (16a), (16b), film pattern processing is performed on the processing regions.

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TAKAHASHI NOBUAKI (JP)
AKAGI KIYOSHI (JP)
SHIMIZU GO (JP)
SATO YOSHIKATSU (JP)

PCT/JP2016/067860

December 22, 2016

June 15, 2016

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KONICA MINOLTA INC (JP)
ULVAC INC (JP)

C23C14/56; C23C14/04

JP2009076690A

2009-04-09

ISONO INTERNATIONAL PATENT OFFICE, P. C. (JP)
Patent business corporation Isono international patent trademark office (JP)

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