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Patent Searching and Data


Title:
PATTERN FORMATION MATERIAL, CURED FILM, AND PRODUCTION METHOD FOR CURED PATTERN
Document Type and Number:
WIPO Patent Application WO/2019/221194
Kind Code:
A1
Abstract:
A pattern formation material containing: an acid group-containing resin having a polymerizable double bond; and a lithium partially-fixed smectite.

Inventors:
YAMADA Shunsuke (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
KANO Yuusuke (Central Research Laboratories 631, Sakado, Sakura-sh, Chiba 68, 〒2858668, JP)
SAKURAI Hiroko (Central Research Laboratories 631, Sakado, Sakura-sh, Chiba 68, 〒2858668, JP)
NAKASHIMA Michiya (Central Research Laboratories 631, Sakado, Sakura-sh, Chiba 68, 〒2858668, JP)
Application Number:
JP2019/019364
Publication Date:
November 21, 2019
Filing Date:
May 15, 2019
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Assignee:
DIC CORPORATION (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
International Classes:
G03F7/004; C08F299/02; C08L33/02; C08L35/00; G03F7/027; G03F7/20; H05K3/28
Domestic Patent References:
WO2018168945A12018-09-20
WO2018168947A12018-09-20
Foreign References:
JP2017198977A2017-11-02
JP2011183812A2011-09-22
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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