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Patent Searching and Data


Title:
PATTERN FORMATION METHOD, COMPOSITION FOR PROTECTIVE FILM FORMATION, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/098809
Kind Code:
A1
Abstract:
A pattern formation method including: (a) a step for applying a coating of an actinic ray-sensitive or a radiation-sensitive resin composition onto a substrate, and forming an actinic ray-sensitive or a radiation-sensitive film; (b) a step for applying a coating of a composition for protective film formation onto the actinic ray-sensitive or radiation-sensitive film, and forming a protective film; (c) a step for causing the actinic ray-sensitive or radiation-sensitive film coated with the protective film to be exposed to light; and (d) a step for developing the exposed actinic ray-sensitive or radiation-sensitive film with a developer containing an organic solvent. The protective film contains a resin (X) having a proton acceptor functional group.

Inventors:
TANGO NAOHIRO (JP)
INOUE NAOKI (JP)
YAMAMOTO KEI (JP)
SHIRAKAWA MICHIHIRO (JP)
GOTO AKIYOSHI (JP)
Application Number:
JP2015/085206
Publication Date:
June 23, 2016
Filing Date:
December 16, 2015
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/11; C08F220/34; G03F7/32; H01L21/027
Foreign References:
JP2014056194A2014-03-27
JP2013076974A2013-04-25
JP2011221513A2011-11-04
JPH07179754A1995-07-18
JP2008033087A2008-02-14
JP2015135492A2015-07-27
JP2015129939A2015-07-16
JP2015152782A2015-08-24
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
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