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Title:
PATTERN FORMATION METHOD, ELECTRONIC-DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/171425
Kind Code:
A1
Abstract:
A pattern formation method that includes the following steps, in this order: a step in which an actinic-light-sensitive or radiation-sensitive film is formed by coating a substrate with an actinic-light-sensitive or radiation-sensitive resin composition containing a solvent, a compound that produces an acid upon exposure to actinic light or radiation, and a resin, the solubility of which in a developer that contains at least one organic solvent can be reduced by the action of an acid; a step in which the actinic-light-sensitive or radiation-sensitive film is exposed through an immersion liquid; a step in which the actinic-light-sensitive or radiation-sensitive film is heated; and a step in which the actinic-light-sensitive or radiation-sensitive film is developed in a developer containing an organic solvent. This pattern formation method also includes a step or steps, after the film-formation step but before the exposure step and/or after the exposure step but before the heating step, in which the actinic-light-sensitive or radiation-sensitive film is washed.

Inventors:
NAKAMURA TAKASHI (JP)
YAMANAKA TSUKASA (JP)
Application Number:
PCT/JP2014/060631
Publication Date:
October 23, 2014
Filing Date:
April 14, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/38; G03F7/038; G03F7/039; H01L21/027
Foreign References:
JP2013057836A2013-03-28
JP2008141043A2008-06-19
JP2005277053A2005-10-06
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
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