Title:
PATTERN FORMATION METHOD, MACHINED SUBSTRATE MANUFACTURING METHOD, OPTICAL COMPONENT MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND IMPRINT MOLD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/170631
Kind Code:
A1
Abstract:
A layer of a curable composition (A1) containing a polymerizable compound component (a1) is disposed on the surface of a substrate. Droplets of a curable composition (A2) containing at least a polymerizable compound component (a2) are discretely dripped on the curable composition (A1) layer. The mixed layer of the curable composition (A1) and the curable composition (A2) is sandwiched between the substrate and a mold having a pattern. The mixed layer is cured by being irradiated with light. The mold is separated from the mixed layer after curing, and a pattern is formed on the substrate. The contact angle of a solvent-removing component composition in the curable composition (A1) relative to the surface of the mold does not exceed 10º.
Inventors:
ITO TOSHIKI (JP)
Application Number:
PCT/JP2017/012790
Publication Date:
October 05, 2017
Filing Date:
March 29, 2017
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
H01L21/027; B29C59/02
Foreign References:
| JP2014189616A | 2014-10-06 | |||
| JP2011159924A | 2011-08-18 | |||
| JP2009208409A | 2009-09-17 | |||
| JP2013254783A | 2013-12-19 | |||
| JP2015128134A | 2015-07-09 | |||
| JP2011258739A | 2011-12-22 | |||
| JP2010232356A | 2010-10-14 |
Attorney, Agent or Firm:
OKABE Yuzuru et al. (JP)
Download PDF: