Title:
PATTERN FORMATION METHOD, PHOTOMASK MANUFACTURING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/158994
Kind Code:
A1
Abstract:
Provided is a pattern formation method including a step for applying an actinic-ray-sensitive or radiation-sensitive resin composition onto a substrate and forming an actinic-ray-sensitive or radiation-sensitive film, a step for simultaneously irradiating the actinic-ray-sensitive or radiation-sensitive film with a plurality of electron beams, and a step for developing the actinic-ray-sensitive or radiation-sensitive film after the electron beam irradiation. The composition contains a resin (A), a photoacid generator (B), and an acid diffusion controller (C), the molar ratio (Qp) between the photoacid generator (B) and the acid diffusion controller (C) represented by the following formula (1) being 0. 3. Qp (molar ratio) = acid diffusion controller (C)/photoacid generator (B).
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Inventors:
MOCHIZUKI HIDEHIRO (JP)
HIRANO SHUJI (JP)
TAKADA AKIRA (JP)
HIRANO SHUJI (JP)
TAKADA AKIRA (JP)
Application Number:
PCT/JP2016/060222
Publication Date:
October 06, 2016
Filing Date:
March 29, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/038; G03F7/039; G03F7/20
Foreign References:
| JP2015028576A | 2015-02-12 | |||
| JP2011203646A | 2011-10-13 | |||
| JP2015005729A | 2015-01-08 | |||
| JP2011517130A | 2011-05-26 | |||
| JP2006080304A | 2006-03-23 |
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
Masatoshi Kurata (JP)
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