Title:
PATTERN-FORMING COMPOSITION, CURED FILM, LAMINATE, PATTERN-PRODUCING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2020/246405
Kind Code:
A1
Abstract:
Provided are: a pattern-forming composition which is for imprinting and contains (A) a polymerizable compound that contains an aromatic ring but does not contain a hydroxyl group, (B) a photopolymerization initiator that contains an aromatic ring but does not contain a hydroxyl group, and (C) a photopolymerization initiator that has a specific structure containing a hydroxyl group, wherein the viscosity at 23°C of a component obtained by removing a solvent from the pattern-forming composition is at most 300 mPa∙s; a cured film to which the pattern-forming composition is applied; a laminate; a pattern-producing method; and a method for manufacturing a semiconductor element.
Inventors:
GOTO YUICHIRO (JP)
Application Number:
PCT/JP2020/021513
Publication Date:
December 10, 2020
Filing Date:
June 01, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B82Y40/00; C08F2/50; H01L21/027
Foreign References:
| JP2014170949A | 2014-09-18 | |||
| JP2015070145A | 2015-04-13 | |||
| JP2013225625A | 2013-10-31 | |||
| JP2013179159A | 2013-09-09 | |||
| JP2008105414A | 2008-05-08 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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