PATTERN FORMING MATERIAL, AND PATTERN FORMING DEVICE AND PATTERN FORMING METHOD

WIPO Patent Application WO/2006/009117

A1

A pattern forming material which is excellent in operability and follow-up feature for unevenness of a base material surface, can prevent the sensitivity of a photosensitive layer from lowering, and can form a high-precision pattern; and a pattern forming device provided with the pattern forming material and a pattern forming method using the pattern forming material. The pattern forming material comprises a cushion layer and a photosensitive layer formed in this order on a support, characterized in that, when the viscosity coefficient of the cushion layer is &eegr ₁ and the viscosity coefficient of the photosensitive layer is &eegr ₂, respective viscosity coefficients at a temperature T&ring C within a range, 80&ring C through 120&ring C, satisfy a relation, &eegr ₁≤&eegr ₂; a pattern forming device provided with the pattern forming material; and a pattern forming method characterized by including at least exposing to light the photosensitive layer in the pattern forming material.

TAKAHASHI HIDENORI (JP)
TAKASHIMA MASANOBU (JP)
MATSUMOTO HIROTAKA (JP)

PCT/JP2005/013173

January 26, 2006

July 15, 2005

Click for automatic bibliography generation  

FUJI PHOTO FILM CO LTD (JP)
TAKAHASHI HIDENORI (JP)
TAKASHIMA MASANOBU (JP)
MATSUMOTO HIROTAKA (JP)

G03F7/004; G03F7/11; G03F7/20; H01L21/027; H05K3/06; (IPC1-7): G03F7/004; G03F7/11; G03F7/20; H01L21/027; H05K3/06

JP2002148792A	2002-05-22
JP2002236361A	2002-08-23
JP2004170750A	2004-06-17
JP2003005364A	2003-01-08
JP2001350255A	2001-12-21
JP2000330291A	2000-11-30

Hirota, Koichi (NAGARE & ASSOCIATES 4th Floor, Shinjuku TR Bldg., 2-2-13, Yoyogi, Shibuya-k, Tokyo, JP)

View/Download PDF      PDF Help

Previous Patent: INFORMATION RECORDING MEDIUM REPRODUCING DEVICE

Next Patent: SURFACE COATING CUTTING TOOL WITH COATING FILM HAVING INTENSITY DISTRIBUTION OF COMPRESSION STRESS