PATTERN FORMING METHOD AND ELECTRONIC CIRCUIT

Title:

PATTERN FORMING METHOD AND ELECTRONIC CIRCUIT

Document Type and Number:

WIPO Patent Application WO/2006/070649

Kind Code:

A1

Abstract:

A pattern forming method by which a pattern for an electronic circuit and the like can be formed by a small number of steps without using a strongly acidic or strongly alkaline etching solution. The pattern forming method is provided with a stacked body forming step for forming a stacked body (15) of a reflection preventing layer (13) and a thin film layer (14) by successively forming the reflection preventing layer (13) and the thin film layer (14) on one main plane of a transparent substrate (10), and a stacked body opening section forming step for forming an opening section on the stacked body (15) by irradiating the stacked body (15) with a first laser beam (L1).

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Inventors:

Satoh, Ryohei
Iwata, Yoshinori
Nakagawa, Koji
Tanaka, Kenji
Takaki, Satoru

Application Number:

PCT/JP2005/023406

Publication Date:

July 06, 2006

Filing Date:

December 20, 2005

Export Citation:

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Assignee:

ASAHI GLASS CO., LTD. (12-1, Yurakucho 1-chome Chiyoda-k, Tokyo 05, 10084, JP)
Satoh, Ryohei
Iwata, Yoshinori
Nakagawa, Koji
Tanaka, Kenji
Takaki, Satoru

International Classes:

H01J9/02; H01J9/20; H01J17/49

Attorney, Agent or Firm:

Oguri, Shohei (Eikoh Patent Office, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 10500, JP)

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