Title:
PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/130932
Kind Code:
A1
Abstract:
A new pattern forming method capable of forming fine patterns with a simpler procedure, and an electronic device manufacturing method are provided. This pattern forming method involves a step A for forming a film of thickness T on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin and a photoacid generator, a step B for exposing the film to actinic rays or radiation, and a step C for developing the exposed film using a developing agent to form a pattern, wherein, in step B, exposure is carried out with an amount of exposure light greater than the exposure light amount calculated by a prescribed method.
Inventors:
HIRANO SHUJI (JP)
Application Number:
PCT/JP2017/002242
Publication Date:
August 03, 2017
Filing Date:
January 24, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/20; C08F212/14; C08F220/26; G03F7/038; G03F7/039; G03F7/32; H01L21/027
Foreign References:
| JP2015102837A | 2015-06-04 | |||
| JP2008281975A | 2008-11-20 | |||
| JP2015087644A | 2015-05-07 | |||
| JPH0770493A | 1995-03-14 | |||
| JP2012018198A | 2012-01-26 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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