PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING SAME, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2015/022820

A1

Provided is a pattern forming method which comprises, in the following order: a step (1) wherein a film is formed using an active light sensitive or radiation sensitive resin composition that contains (A) a resin having a repeating unit represented by general formula (I) such as a hydroxystyrene protected by an acid labile group and a compound represented by general formula (II), which is an acid generator having a steroid skeleton or the like; a step (2) wherein the film is exposed using an electron beam or extreme ultraviolet light; and a step (3) wherein the film is developed after the exposure with use of a developer liquid that contains an organic solvent. By this pattern forming method, excellent pattern collapse performance, excellent roughness performance and excellent development defect performance can be satisfied at high levels in the formation of an ultrafine pattern (for example, one having a line width of 50 nm or less). Also provided are: a method for manufacturing an electronic device using this pattern forming method; and an electronic device.

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JP3158710	FORMATION OF CHEMICAL AMPLIFICATION RESIST PATTERN
JP2006150722	METHOD FOR MAKING LITHOGRAPHIC PRINTING PLATE, PHOTOSENSITIVE LITHOGRAPHIC PRINTING PLATE MATERIAL AND LITHOGRAPHIC PRINTING METHOD

NIHASHI WATARU (JP)
MORI HIROKI (JP)

PCT/JP2014/067956

February 19, 2015

July 04, 2014

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FUJIFILM CORP (JP)

G03F7/004; G03F7/038; G03F7/039

JP2009269953A	2009-11-19
JP2009080474A	2009-04-16
JP2010217884A	2010-09-30

TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)

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