Title:
PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM AND MASK BLANK
Document Type and Number:
WIPO Patent Application WO/2016/017248
Kind Code:
A1
Abstract:
This pattern forming method comprises: a step for forming a film using an active light sensitive or radiation sensitive resin composition; a step for exposing the film to active light or radiation; and a step for developing the light-exposed film using a developer liquid that contains an organic solvent. The active light sensitive or radiation sensitive resin composition contains a compound that has a partial structure represented by general formula (I).
Inventors:
TSUCHIMURA TOMOTAKA (JP)
Application Number:
PCT/JP2015/064462
Publication Date:
February 04, 2016
Filing Date:
May 20, 2015
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; C08F212/14; G03F7/004; G03F7/039; G03F7/32
Foreign References:
| JP2013080002A | 2013-05-02 | |||
| JP2013205811A | 2013-10-07 | |||
| JP2013033227A | 2013-02-14 | |||
| JP2013164588A | 2013-08-22 | |||
| JP2014134686A | 2014-07-24 | |||
| JP2003337414A | 2003-11-28 | |||
| JP2013064829A | 2013-04-11 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
Junko Nakajima (JP)
Junko Nakajima (JP)
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