Title:
PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/138267
Kind Code:
A1
Abstract:
To provide: a pattern forming method which enables the formation of a pattern having excellent resolution, excellent dry etching resistance and excellent outgas properties; and a method for manufacturing an electronic device, which includes this pattern forming method. This pattern forming method comprises (1) a step for forming a film with use of an active light sensitive or radiation sensitive resin composition, (2) a step for exposing the film to active light or radiation, and (3) a step for developing the light-exposed film with use of a developer liquid containing an organic solvent. The active light sensitive or radiation sensitive resin composition contains an acid-decomposable resin (1) that has (a) a repeating unit having an aromatic ring and (b) a repeating unit represented by a specific general formula, with the content of the repeating unit (a) being 55 mol% or more relative to all the repeating units of the acid-decomposable resin (1). A method for manufacturing an electronic device according to the present invention includes this pattern forming method.
Inventors:
TSUCHIMURA TOMOTAKA (JP)
KANEKO AKIHIRO (JP)
NIHASHI WATARU (JP)
KANEKO AKIHIRO (JP)
NIHASHI WATARU (JP)
Application Number:
PCT/JP2016/088303
Publication Date:
August 17, 2017
Filing Date:
December 22, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; C08F212/12; C08F220/16; G03F7/039; G03F7/20; G03F7/32
Domestic Patent References:
| WO2014148241A1 | 2014-09-25 |
Foreign References:
| JP2013137524A | 2013-07-11 | |||
| JP2015031851A | 2015-02-16 | |||
| JP2013080006A | 2013-05-02 | |||
| JP2013080004A | 2013-05-02 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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