Title:
PATTERN FORMING METHOD, METHOD FOR FORMING PATTERNED MASK, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/046449
Kind Code:
A1
Abstract:
A pattern forming method which comprises:(I) a step wherein an active light sensitive or radiation sensitive resin composition, which contains (A) a resin having a repeating unit containing a group that is decomposed by the action of an acid and generates a polar group and (B) a compound that generates an acid by irradiation of active light or radiation, is applied to a substrate so as to form a first film; (II) a step wherein the first film is exposed; (III) a step wherein the exposed first film is developed so as to form a line-and-space pattern; and (IV) a step wherein the line-and-space pattern is covered by a second film. This pattern forming method is characterized in that the top width of the line pattern of the line-and-space pattern formed in the step (III) is larger than the bottom width thereof.
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Inventors:
YAMAMOTO HISAO (JP)
SUGIYAMA SHINICHI (JP)
SUGIYAMA SHINICHI (JP)
Application Number:
PCT/JP2014/075681
Publication Date:
April 02, 2015
Filing Date:
September 26, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/40; G03F7/004; G03F7/039; H01L21/027; H01L21/3065
Domestic Patent References:
| WO2009150870A1 | 2009-12-17 | |||
| WO2008016061A1 | 2008-02-07 |
Foreign References:
| JP2011164345A | 2011-08-25 | |||
| JP2003255564A | 2003-09-10 | |||
| JP2012517612A | 2012-08-02 | |||
| JP2013164509A | 2013-08-22 | |||
| JP2010287890A | 2010-12-24 | |||
| JP2014164044A | 2014-09-08 | |||
| JP2014035421A | 2014-02-24 |
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
Masatoshi Kurata (JP)
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