Title:
PATTERN FORMING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/061512
Kind Code:
A1
Abstract:
Provided are: a pattern forming method which is capable of forming a pattern with excellent surface properties when an active light sensitive or radiation sensitive film having a thick film thickness is formed; a method for producing an electronic device; and an active light sensitive or radiation sensitive composition. This pattern forming method comprises the steps (i), (ii) and (iii) described below.
(i) a step for forming an active light sensitive or radiation sensitive film having a film thickness that is thicker than 9 μm but not thicker than 20 μm with use of an active light sensitive or radiation sensitive composition containing a solvent (S) that satisfies a specific condition
(ii) a step for irradiating the active light sensitive or radiation sensitive film with active light or radiation
(iii) a step for developing the active light sensitive or radiation sensitive film, which has been irradiated with active light or radiation, with use of a developer liquid
Inventors:
YOSHINO FUMIHIRO (JP)
Application Number:
PCT/JP2017/029688
Publication Date:
April 05, 2018
Filing Date:
August 18, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
WO2008023750A1 | 2008-02-28 |
Foreign References:
JP2004224856A | 2004-08-12 | |||
JP2003286278A | 2003-10-10 | |||
JP2006011181A | 2006-01-12 | |||
JP2015057638A | 2015-03-26 | |||
JP2016133743A | 2016-07-25 | |||
JP2007248727A | 2007-09-27 | |||
JP2016206673A | 2016-12-08 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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