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Patent Searching and Data


Title:
PATTERN FORMING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/061512
Kind Code:
A1
Abstract:
Provided are: a pattern forming method which is capable of forming a pattern with excellent surface properties when an active light sensitive or radiation sensitive film having a thick film thickness is formed; a method for producing an electronic device; and an active light sensitive or radiation sensitive composition. This pattern forming method comprises the steps (i), (ii) and (iii) described below. (i) a step for forming an active light sensitive or radiation sensitive film having a film thickness that is thicker than 9 μm but not thicker than 20 μm with use of an active light sensitive or radiation sensitive composition containing a solvent (S) that satisfies a specific condition (ii) a step for irradiating the active light sensitive or radiation sensitive film with active light or radiation (iii) a step for developing the active light sensitive or radiation sensitive film, which has been irradiated with active light or radiation, with use of a developer liquid

Inventors:
YOSHINO FUMIHIRO (JP)
Application Number:
PCT/JP2017/029688
Publication Date:
April 05, 2018
Filing Date:
August 18, 2017
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
WO2008023750A12008-02-28
Foreign References:
JP2004224856A2004-08-12
JP2003286278A2003-10-10
JP2006011181A2006-01-12
JP2015057638A2015-03-26
JP2016133743A2016-07-25
JP2007248727A2007-09-27
JP2016206673A2016-12-08
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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