Title:
PATTERN-FORMING METHOD AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/210579
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a pattern-forming method that is capable of forming a pattern that has excellent limit resolution properties and excellent in-plane uniformity of resolution. In addition, the present invention addresses another problem of providing a method for producing an electronic device by using the abovementioned pattern-forming method. The pattern-forming method according to the present invention comprises: step 1 for forming a resist film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition containing resin X that undergoes a reduction in the molecular weight thereof due to cleavage of the main chain thereof caused by the effect of exposure to light, an acid, or a base; step 2 for exposing the resist film to light; and step 3 for subjecting the exposed resist film to a development process using a development liquid containing an organic solvent to remove an exposed portion. The method may further comprise, after step 3, step 4 for cleaning the pattern using a rinse liquid containing an organic solvent. If the pattern-forming method does not comprise step 4 after the step 3, the development liquid is a chemical liquid containing at least two organic solvents. If the pattern-forming method comprises step 4 after step 3, at least one of the development liquid and the rinse liquid is a chemical liquid containing at least two organic solvents. The chemical liquid containing at least two organic solvents contains at least an organic solvent having a boiling point of at least 100°C.
More Like This:
| WO/2002/069043 | LOW ABSORBING RESISTS FOR 157 NM LITHOGRAPHY |
| JPS62209529 | PHOTOSENSITIVE MATERIAL |
| WO/1999/067794 | UV-CURABLE EPOXY FORMULATIONS, INCLUDING CONDUCTIVE COMPOSITIONS |
Inventors:
SHIRAKAWA MICHIHIRO (JP)
TAKAHASHI SATOMI (JP)
TAKAHASHI SATOMI (JP)
Application Number:
PCT/JP2023/016115
Publication Date:
November 02, 2023
Filing Date:
April 24, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/039; G03F7/32
Domestic Patent References:
| WO2022024714A1 | 2022-02-03 | |||
| WO2023286763A1 | 2023-01-19 | |||
| WO2019187632A1 | 2019-10-03 |
Foreign References:
| JP2012150441A | 2012-08-09 | |||
| JP2000039717A | 2000-02-08 | |||
| JPS62136638A | 1987-06-19 | |||
| JP2003076013A | 2003-03-14 | |||
| JP2010122271A | 2010-06-03 | |||
| JPH06340802A | 1994-12-13 | |||
| US20100203450A1 | 2010-08-12 | |||
| JPS62254143A | 1987-11-05 | |||
| JP2006011182A | 2006-01-12 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF: