Title:
PATTERN FORMING METHOD, METHOD FOR PRODUCING PROCESSED SUBSTRATE, METHOD FOR PRODUCING OPTICAL COMPONENT, METHOD FOR PRODUCING CIRCUIT BOARD, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING IMPRINT MOLD
Document Type and Number:
WIPO Patent Application WO/2017/170466
Kind Code:
A1
Abstract:
According to the present invention, a pattern is formed on a substrate by: forming a layer of a curable composition (A1) containing a component (a1) that is a polymerizable compound and a component (e1) on the surface of the substrate; discretely dropping droplets of a curable composition (A2) containing at least a component (a2) that is a polymerizable compound on the layer of the curable composition (A1), thereby sandwiching a mixed layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate; curing the mixed layer by means of light irradiation; and separating the mold from the mixed layer after curing. In this connection, the component (e1) is a compound that has a higher surface tension than the component (a1); and the surface tension of a composition of the components of the curable composition (A1) excluding the solvent is higher than the surface tension of a composition of the components of the curable composition (A2).
Inventors:
OTANI TOMONORI (JP)
ITO TOSHIKI (JP)
ITO TOSHIKI (JP)
Application Number:
PCT/JP2017/012507
Publication Date:
October 05, 2017
Filing Date:
March 28, 2017
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
H01L21/027; B29C59/02
Domestic Patent References:
| WO2011155602A1 | 2011-12-15 |
Foreign References:
| JP2014093385A | 2014-05-19 | |||
| JP2011508680A | 2011-03-17 | |||
| JP2016028419A | 2016-02-25 | |||
| JP2010508662A | 2010-03-18 |
Attorney, Agent or Firm:
OKABE Yuzuru et al. (JP)
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