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Title:
PATTERN-FORMING METHOD, METHOD FOR PRODUCING PROCESSING SUBSTRATE, METHOD FOR PRODUCING OPTICAL COMPONENT, METHOD FOR PRODUCING CIRCUIT SUBSTRATE, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING IMPRINT MOLD
Document Type and Number:
WIPO Patent Application WO/2017/170128
Kind Code:
A1
Abstract:
A layer comprising a curable composition (A1) containing a polymerizable compound (a1) is formed on the surface of a substrate, liquid droplets comprising a curable composition (A2) containing a polymerizable compound (a2) are dropped in a discrete manner on the layer comprising the curable composition (A1), a mixed layer formed by the partial mixing of the curable composition (A1) and the curable composition (A2) is sandwiched between a mold and the substrate, the mixed layer is cured by irradiating the mixed layer with light from the mold side, and the mold is separated from the cured mixed layer, thereby forming a pattern of cured material on the substrate. The pattern of cured material is formed as a result of the above process with uniform precision in a plurality of shot regions on the substrate by setting the viscosity at 25℃ of a composition obtained by removing solvent from the curable composition (A1) to at least 40 mPa・s and less than 500 mPa・s, and by setting the viscosity at 25℃ of a composition obtained by removing solvent from the curable composition (A2) to at least 1 mPa・s and less than 40 mPa・s.

Inventors:
CHIBA KEIKO (JP)
ITO TOSHIKI (JP)
STACHOWIAK BRIAN TIMOTHY (JP)
KHUSNATDINOV NIYAZ (JP)
LIU WEIJUN (JP)
Application Number:
PCT/JP2017/011736
Publication Date:
October 05, 2017
Filing Date:
March 23, 2017
Export Citation:
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Assignee:
CANON KK (JP)
International Classes:
H01L21/027; B29C59/02
Domestic Patent References:
WO2011155602A12011-12-15
Foreign References:
JP2015130535A2015-07-16
JP2016028419A2016-02-25
JP2010508662A2010-03-18
JP2011508680A2011-03-17
JP2014093385A2014-05-19
JP2017055108A2017-03-16
Attorney, Agent or Firm:
OKABE Yuzuru et al. (JP)
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